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Home>Supermicro>Servers & Storage>Rackmount Servers>2U Dual Processor>Mainstream SuperServer SYS-221P-C9R

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Mainstream SuperServer SYS-221P-C9R

Key Applications

  • Virtualization
  • Enterprise Server
  • Application and data serving
  • Compute Intensive Applications

Key Features

 

  1. Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors,supports up to 300W TDP
  2. 16 DIMM slots, Up to 4TB DDR5-5600MHZ/4800MHz ECC Registered RDIMM
  3. 4 PCIe 5.0 x16 Low Profile (LP), 1 PCIe 5.0 x8 Low Profile (LP)
  4. 16 hotswap 2.5″ drive bays with 8 SAS RAID (0, 1, 5, 6, 10, 50, 60) and 8 SATA drive support
  5. 1200W Redundant Titanium level Power Supplies

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Product SKUs
SuperServer SYS-221P-C9R
Motherboard
Super X13DEI
Processor
CPU
  • Dual Socket E (LGA-4677)
  • 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors
Note
  • Supports up to 300W TDP CPUs (Air Cooled)
System Memory
Memory
  • Slot Count: 16 DIMM slots
  • Max Memory (1DPC): Up to 4TB 5600MT/s ECC DDR5 RDIMM
  • View Memory Options
On-Board Devices
Chipset
  • Intel® C741
Network Connectivity
NVMe
Input / Output
LAN
  • 1 RJ45 1 GbE Dedicated BMC LAN port(s)
USB
  • 2 USB 2.0 port(s) (front)
  • 4 USB 3.0 port(s) (rear)
Video
  • 1 VGA port(s)
Serial
  • 1 COM port(s) (Rear)
  • 1 COM port(s) (Front)
DOM
  • 2 SuperDOM (Disk on Module) port(s)
TPM
  • 1 TPM Onboard/port 80
System BIOS
BIOS Type
  • AMI 32MB SPI Flash EEPROM
Management
Software
  • SuperCloud Composer
  • Supermicro Server Manager (SSM)
  • Supermicro Update Manager (SUM)
  • Supermicro SuperDoctor® 5 (SD5)
  • Super Diagnostics Offline (SDO)
  • Supermicro Thin-Agent Service (TAS)
  • SuperServer Automation Assistant (SAA) New!
Power configurations
  • ACPI/APM Power Management
Security
Hardware
  • Trusted Platform Module (TPM) 2.0
  • Silicon Root of Trust (RoT) – NIST 800-193 Compliant
Features
  • Cryptographically Signed Firmware
  • Secure Boot
  • Secure Firmware Updates
  • Automatic Firmware Recovery
  • Supply Chain Security: Remote Attestation
  • Runtime BMC Protections
  • System Lockdown
PC Health Monitoring
CPU
  • Monitors for CPU Cores, Chipset Voltages, Memory
FAN
  • Fans with tachometer monitoring
  • Status monitor for speed control
  • Pulse Width Modulated (PWM) fan connectors
Temperature
  • Monitoring for CPU and chassis environment
  • Thermal Control for fan connectors
Chassis
Form Factor
  • 2U Rackmount
Model
  • CSE-213BTS-R1K23LPBP3-1
Dimensions and Weight
Height
  • 3.5″ (89 mm)
Width
  • 17.2″ (437 mm)
Depth
  • 24.8″ (630 mm)
Package
  • 11″ (H) x 29″ (W) x 38.7″ (D)
Weight
  • Gross Weight: 63 lbs (28.8 kg)
  • Net Weight: 38 lbs (17.4 kg)
Available Color
  • Black
Front Panel
LED
  • HDD activity
  • Network activity
  • Power status
  • System information (overheat/UID)
Buttons
  • Power On/Off
  • System Reset
Expansion Slots
PCI-Express (PCIe) Configuration
M.2
  • 2 M.2 PCIe 4.0 x2 NVMe slot(s) (M-key)
Drive Bays / Storage
Drive Bays Configuration
  • Default: Total 16 bay(s)
    • 4 front hot-swap 2.5″ NVMe*/SAS drive bay(s)
    • 4 front hot-swap 2.5″ SAS drive bay(s)
    • 8 front hot-swap 2.5″ SATA drive bay(s)
  • (*NVMe support may require additional storage controller and/or cables, please see the optional parts list for details)
  • View Drive Options
M.2
  • 2 M.2 NVMe slot(s) (M-key)
  • View M.2 Options
Peripheral Bays
  • 1 slim DVD bay(s) (optional)
System Cooling
Fans
  • 3x 8cm heavy duty fans with optimal fan speed control
Power Supply
1x 1200W Redundant Titanium Level (96%) power supply
Dimension (WxHxL) 76 x 40 x 336 mm
AC Input 1000W: 100-127Vac / 50-60Hz
1200W: 200-240Vac / 50-60Hz
1200W: 200-240Vdc / 50-60Hz (for CCC only)
+12V Max: 83A / Min: 0A (100Vac-127Vac)
Max: 100A / Min: 0A (200Vdc-240Vdc)
Max: 100A / Min: 0A (200Vac-240Vac)
5V SB Max: 4A / Min: 0A
Output Type Backplanes (gold finger)
Operating Environment
ROHS
  • RoHS Compliant
Environmental Spec.
  • Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F)
  • Non-operating Temperature: -30°C to 60°C (-40°F to 140°F)
  • Operating Relative Humidity: 8% to 80% (non-condensing)
  • Non-operating Relative Humidity: 8% to 90% (non-condensing)

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Key Applications
  • Virtualization
  • Software-defined Storage
  • High Performance Computing
  • Cloud Computing
  • Enterprise Server
Key Features  
  1. Dual Intel® Xeon® 6 6700 series processors with E-cores
  2. 32 DIMM slots supporting up to 2TB of memory
  3. 3 PCIe 5.0 x16 slots with support for Network/Storage/GPU/Accelerator cards
  4. Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible)
  5. 8x 2.5" hot-swap NVMe/SATA/SAS drive bays; Optional 4x 2.5" hot-swap NVMe/SAS/SATA drive bays; 2x internal M.2 NVMe drive slots; Optional RAID support via storage add-on card
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Key Applications
  • Virtualization
  • Software-defined Storage
  • AI Inference and Machine Learning
  • Cloud Computing
  • Enterprise Server
Key Features  
  1. Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors
  2. 32 DIMM slots supporting up to 8TB of memory; RDIMMs up to DDR5-5600
  3. 3 PCIe 5.0 x16 slots with support for GPU/Accelerator cards
  4. Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible)
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  6. 8 heavy duty hot-swap fans with optimal fan speed control
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Key Applications
  • Virtualization
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Key Features  
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    • 2 PCIe 5.0 x16 FH, 10.5"L
    • 1 PCIe 5.0 x16, FH, 6.6"L
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  5. 2 On-board PCIe 3.0 x4 M.2 NVMe 80mm/110mm (Boot)
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CloudDC SuperServer SYS-121C-TN2R (Complete System Only )

Key Applications
  • Web Server, Firewall Application
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  • Cloud Computing, Compact Server
  • DNS & Gateway Servers, Firewall Application
  • CDN, Edge Nodes
Key Features  
  1. Dual sockets E (LGA-4677) 5th and 4th Gen Intel®  Xeon® Scalable processors
  2. 16 DIMMs up to 4TB 3DS ECC DDR5-5600: RDIMM
    • 2 PCIe 5.0 x16 FHHL;
    • 2 PCIe 5.0 x4 NVMe M.2
  4. Dual AIOM (OCP 3.0) slots with NCSI for networking, 1 dedicated IPMI LAN
  5. 8x 2.5" hot-swap SATA/SAS4 w/ 2x hybrid NVME drive bays
  6. 1 VGA, 1 COM, 2 USB 3.0 (rear)
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Key Applications
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Key Features  
  1. Dual sockets E (LGA-4677) 5th and 4th Gen Intel®  Xeon® Scalable processors
  2. 16 DIMMs up to 4TB 3DS ECC DDR5-5600: RDIMM
    • 2 PCIe 5.0 x16 FHHL;
    • 2 PCIe 5.0 x4 NVMe M.2
  4. Dual AIOM (OCP 3.0) slots with NCSI for networking, 1 dedicated IPMI LAN
  5. 4x 3.5/2.5" hot-swap hybrid NVMe/SATA/SAS drive bays
  6. 6 counter-rotating 4 cm PWM fans with optimal fan speed control, 2 air shrouds
  7. 860W redundant Titanium level 100-240Vac and 200-240 Vdc power supplies
  8. 1 VGA, 1 COM, 2 USB 3.0 (rear)
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Key Applications
  • Web Server, Firewall Application
  • Data Center Optimized, Value IaaS
  • Cloud Computing, Compact Server
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Key Features  
  1. Dual sockets E (LGA-4677) 5th and 4th Gen Intel®  Xeon® Scalable processors
  2. 16 DIMMs up to 4TB 3DS ECC DDR5-5600: RDIMM
    • 2 PCIe 5.0 x16 FHHL;
    • 2 PCIe 5.0 x4 NVMe M.2
  4. Dual AIOM (OCP 3.0) slots with NCSI for networking, 1 dedicated IPMI LAN
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  6. 6 counter-rotating 4 cm PWM fans with optimal fan speed control, 2 air shrouds
  7. 860W redundant Titanium level 100-240Vac and 200-240 Vdc power supplies
  8. 1 VGA, 1 COM, 2 USB 3.0 (rear), 2 USB 2.0 (front)
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Hyper SuperServer SYS-120H-TNR (Complete System Only )

Key Applications
  • Virtualization
  • Software-defined Storage
  • AI Inference and Machine Learning
  • Cloud Computing
  • Enterprise Server
Key Features  
  1. Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
  2. 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series
  3. 3 PCIe 4.0 x16 slots with support for GPU/Accelerator cards
  4. Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible)
  5. 8x 2.5" hot-swap NVMe/SATA/SAS drive bays; Optional 4x 2.5" hot-swap NVMe/SAS/SATA drive bays; 2x internal M.2 NVMe/SATA drive slots; Optional RAID support via storage add-on card
  6. 8 heavy duty hot-swap fans with optimal fan speed control
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Key Applications
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Key Features  
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  1. Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
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Key Features  
  1. Dual sockets E (LGA-4677) 5th and 4th Gen Intel®  Xeon® Scalable processors
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Key Applications
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  6. 4 heavy duty fans with optimal fan speed control
  7. 1200W redundant Titanium level power supplies
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Key Applications
  • Virtualization
  • Enterprise Server
  • Application and data serving
  • Compute Intensive Applications
Key Features  
  1. Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors,supports up to 300W TDP
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