Intel® Xeon® processor E5-2600 v4†/ v3 family (up to 145W TDP) *
Dual Socket R3 (LGA 2011)
Cores / Cache
Up to 22 Cores† / Up to 55MB† Cache
System Bus
QPI up to 9.6 GT/s
Note
† BIOS version 2.0 or above is required
Note
* Please contact Supermicro Technical Support for additional information about frequency optimized CPUs and specialized system optimization.
System Memory
Memory Capacity
24x 288-pin DDR4 DIMM slots
Up to 3TB† ECC 3DS LRDIMM, 768GB ECC RDIMM
Memory Type
2400†/2133/1866/1600MHz ECC DDR4 SDRAM 72-bit
DIMM Sizes
RDIMM: 64GB, 32GB, 16GB, 8GB, 4GB
LRDIMM: 64GB, 32GB
3DS LRDIMM: 128GB
Memory Voltage
1.2 V
Error Detection
Corrects single-bit errors
On-Board Devices (per Node)
Chipset
Intel® C612 chipset
SAS
SAS3 (12Gbps) via Broadcom 3008; IT mode
IPMI
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
ASPEED AST2400 BMC
Network
Must bundle with at least one SIOM network card
Video
ASPEED AST2400 BMC
Input / Output (per Node)
SAS
3 SAS3 (12Gbps) ports
LAN
1 RJ45 Dedicated IPMI LAN port
USB
2 USB 3.0 ports (rear)
Video
1 VGA port
Others
M.2 and SATA DOM for boot drive only
Chassis
Form Factor
2U Rackmount
Model
CSE-827BHQ+-R2K22BP
Dimensions and Weight
Width
17.6″ (447mm)
Height
3.47″ (88mm)
Depth
30.5″ (775mm)
Package
9.76″ (H) x 24.65″ (W) x 45.28″ (D)
Weight
Gross Weight: 86.5 lbs (39.24 kg)
Net Weight: 56 lbs (25.4 kg)
Available Colors
Black
Front Panel
Buttons
Power On/Off button
UID button
LEDs
Power status LED
HDD activity LED
2 Network activity LEDs
Universal Information (UID) LED
Expansion Slots (per Node)
PCI-Express
2 PCI-E 3.0 (x16) Low-profile slots
1 SIOM card (must bundle with network card)
Drive Bays (per Node)
Hot-swap
3 Hot-swap 3.5″ NVMe/SAS3 drive bays Please contact Supermicro Technical Support for additional information about HDD and SSD if mixed. Some restrictions and configuration rules that apply to SSD are different from HDD.
System Cooling
Fans
4 heavy duty 8cm PWM fans with air shroud
Power Supply
2200W Redundant Power Supplies with PMBus
Total Output Power
1200W/1800W/1980W/2090/2200W
Dimension
(W x H x L)
45 x 40 x 480 mm
Input
1200W: 100-127Vac / 50-60Hz
1800W: 200-220Vac / 50-60Hz
1980W: 220-230Vac / 50-60Hz
2090W: 230-240Vac / 50-60Hz
2090W: 180-220Vac (for UL/cUL only)
2200W: 220-240Vac (for UL/cUL only)
2090W: 230-240Vdc (for CCC only)
+12V
Max: 100A / Min: 0A (100-127Vac)
Max: 150A / Min: 0A (200-220Vac)
Max: 165A / Min: 0A (220-230Vac)
Max: 174.17A / Min: 0A (230-240Vac)
Max: 174.17A / Min: 0A (180-220Vac, UL/cUL only)
Max: 183.33A / Min: 0A (220-240Vac, UL/cUL only)
Max: 174.17A / Min: 0A (230-240Vdc, CCC only)
12Vsb
Max: 2.1A / Min: 0A
Output Type
Gold Finger
Certification
Titanium Level [ Test Report ]
System BIOS
BIOS Type
128Mb SPI Flash EEPROM with AMI BIOS
Operating Environment / Compliance
RoHS
RoHS Compliant
Environmental Spec.
Operating Temperature:
10°C to 35°C (50°F to 95°F)
Non-operating Temperature:
-40°C to 70°C (-40°F to 158°F)
Operating Relative Humidity:
8% to 90% (non-condensing)
Non-operating Relative Humidity:
5% to 95% (non-condensing)
Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series
3 PCIe 4.0 x16 slots with support for GPU/Accelerator cards
Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible)
Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series
3 PCIe 4.0 x16 slots with GPU/Accelerator support (Default);
1 PCIe 4.0 x16 expansion slots (Optional)
Flexible networking options with 2 AIOM networking slots (OCP NIC 3.0 compatible)
Up to 6x 2.5" hot-swap drive bays with options to support NVMe/SATA drives
6 heavy duty hot-swap fans with optimal fan speed control Front I/O, tool-less design
Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
Intel® C621A Chipset
32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series