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A+ Server F1114S-RNTR (Complete System Only)
Key Applications
- Hyperscale / Hyperconverged
- HPC and Big Data
- Data Center Enterprise Applications
- Scale Out Storage
- Telco Data Center
- Virtualization Server
Key Features
8 Hot-pluggable System Nodes in a 4U form factor.
Each node supports:
1.Single AMD EPYC™ 7003/7002 Series Processor
(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
2.Up to 2TB ECC 3DS LRDIMM,
up to DDR4-3200MHz; 8 DIMM slots
3.Expansion slots: 1 PCI-E 4.0 x16 (LP Riser),
1 PCI-E 4.0 x16 (for AIOM)
4.AIOM Network card,
1 dedicated IPMI LAN port
5.1 VGA, 2 USB 3.0 ports
6.6 Hot-swap 2.5" drive bays:
2 NVMe/SATA3,
4 SATA3 (optional NVMe with additional cables)
M.2 Interface: 4 SATA/PCI-E 4.0 x4
M.2 Form Factor: 2242, 2260, 2280, 22110
M.2 Key: M-Key
7.3x 4cm 17.6K RPM middle fans
8.2200W Redundant Power Supplies
Titanium Level (96%)
(Full redundancy based on
configuration and application load)
FatTwin SuperServer SYS-F511E2-RT (Complete System Only)
Key Applications
- Hyperscale / Hyperconverged
- HPC and Big Data
- Data Center Enterprise Applications
- Telco Data Center
- Single Socket E (LGA-4677) Supports 4th/5th Gen Intel® Xeon® Scalable Processor
- C741 Chipset
- Two M.2 Internal Drives
- NVMe/SATA/SAS options
- AIOM and M.2 support; 2 AIOM card support (PCIe 5.0)
- Up to 6x SAS/SATA/NVMe Hot Swap 2.5” Drives
FatTwin SuperServer SYS-F521E3-RTB (Complete System Only)
Key Applications
- Hyperscale / Hyperconverged
- HPC and Big Data
- Data Center Enterprise Applications
- Telco Data Center
- Single Socket E (LGA-4677) Supports 4th/5th Gen Intel® Xeon® Scalable Processor
- C741 Chipset
- Two M.2 Internal Drives
- NVMe/SATA/SAS options
- AIOM and M.2 support; 1 AIOM card support (PCIe 5.0)
- Up to 8x SAS/SATA Hot Swap 3.5” Drives, or up to 6x NVMe Hot Swap 2.5” Drives + 2x SAS/SATA Hot Swap 3.5” Drives
SuperServer 2028TR-HTFR
Key Features
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual socket R3 (LGA 2011) supports
Intel® Xeon® processor E5-2600
v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 1TB† ECC 3DS LRDIMM , up to
DDR4- 2400†MHz ; 8x DIMM slots
3. 1x PCI-E 3.0 x16 (LP) slot
4. Single port IB (FDR, 56Gbps),
w/ QSFP connector
5. Intel® i350 Dual port GbE LAN
6. 6x 2.5" Hot-swap SATA3 drive
bays
7. 1600W Redundant Power Supplies
Titanium Level
8. 2x SATA DOM
SuperServer 6018TR-T
Key Features
Two systems (nodes) in a 1U form factor. Each node supports the following:
1. Dual socket R3 (LGA 2011) supports
Intel® Xeon® processor E5-2600
v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 1TB† ECC 3DS LRDIMM , up to
DDR4- 2400†MHz ; 8x DIMM slots
3. 1x PCI-E 3.0 x16 (in x16) slot
4. 2x 3.5" Hot-swap SAS/SATA drive bays
5. Intel® i350 Dual port GbE LAN
6. I/O ports: 2x SuperDOM, 1x VGA,
1x COM, 2x USB 2.0 (rear)
7. 1000W High-efficiency Power Supply
Titanium Level Certified
SuperServer 6028TR-D72R
Key Features
Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual socket R3 (LGA 2011) supports
Intel® Xeon® processor E5-2600
v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 1TB† ECC 3DS LRDIMM , up to
DDR4- 2400†MHz ; 8x DIMM slots
3. 3x PCI-E 3.0 x8 slots
(1x low-profile and 2x FHHL)
4. Intel® i350 Dual port GbE LAN
5. 6x 3.5" Hot-swap SAS2/SATA3
drive bays
6. SAS2 (6Gbps) via Broadcom 2208
7. 1200W Redundant Power Supplies
Titanium Level
(Updated for 2021 Version)
SuperServer 6028TR-HTFR
Key Features
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual socket R3 (LGA 2011) supports
Intel® Xeon® processor E5-2600
v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 1TB† ECC 3DS LRDIMM , up to
DDR4- 2400†MHz ; 8x DIMM slots
3. 1x PCI-E 3.0 (x16) low-profile slot
4. Single port IB (FDR, 56Gbps),
w/ QSFP connector
5. Intel® i350 Dual port GbE LAN
6. 3x 3.5" Hot-swap SATA3
drive bays
7. 2x SATA DOM
8. 1600W Redundant Power Supplies
Titanium Level
SuperServer 6028TR-HTR
Key Features
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual socket R3 (LGA 2011) supports
Intel® Xeon® processor E5-2600
v4†/ v3 family; QPI up to 9.6GT/s
2. Up to 1TB† ECC 3DS LRDIMM , up to
DDR4- 2400†MHz ; 8x DIMM slots
3. 1x PCI-E 3.0 (x16) low-profile slot
4. Intel® i350 Dual port GbE LAN
5. 3x 3.5" Hot-swap SATA3
drive bays
6. 2x SATA DOM
7. 1600W Redundant Power Supplies
Titanium Level (96%)
SuperServer 6029TR-DTR
Key Applications / Features
- HPC
- Virtualization
- Data Center
- Web Server
Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)‡
2. 8 DIMMs; up to 2TB 3DS ECC
DDR4-2933MHz† RDIMM/LRDIMM
3. 2 PCI-E 3.0 x8 (FH/HL) or 1 PCI-E 3.0
x8 (FH/HL) + 1 PCI-E 3.0 x4 (FH/HL)
+ 1 PCI-E 3.0 x 4 (LP) (8/8/0 or 8/4/4)
4. Dedicated IPMI 2.0 LAN
5. 6 Hot-swap 3.5" SATA3 drive bays
6. 2 SATA DOM + 1 SATA/NVMe
M.2 (22110/2280)
7. Up to 1200W Redundant Power Supplies
Titanium Level (96%)
SuperServer 6029TR-HTR
Key Applications / Features
- HPC
- Data Center
- Enterprise Server
- Finanical Analysis
- Mission-critical applications
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Dual Socket P (LGA 3647) support
2nd Gen Intel® Xeon® Scalable
processors (Cascade Lake/Skylake)‡
2. 8 DIMMs; up to 2TB 3DS ECC
DDR4-2933MHz† RDIMM/LRDIMM
3. 1 PCI-E 3.0 x16 (LP) slot
4. Dedicated IPMI 2.0 LAN
5. 3 Hot-swap 3.5" SATA3 drive bays
6. 2 SATA DOM + 1 SATA/NVMe
M.2 (22110/2280)
7. Up to 1600W Redundant Power Supplies
Titanium Level (96%)
Bestsellers in Twin Servers
GrandTwin SuperServer SYS-210GT-HNC8F (Complete System Only)
Key Applications
- HPC
- Cloud Gaming
- MEC (Multi-Access Edge Computing)
- Multi-Purpose CDN
- High-availability Cache Cluster
- Telco Edge Cloud
- EDA (Electric Design Automation)
- Mission Critical Web Applications
- Single-Socket, 3rd Gen Intel® Xeon® Scalable processors up to 270W TDP
- Intel® C621A
- 16 DIMM Slots up to 4TB
- Optional: AIOM PCIe 4.0 x16 LP (OCP 3.0 compliant)
- Two optional storage modules. Each module supports 2x NVMe or SAS/SATA drive bays
- 2x cooling fans per 2U enclosure, 16.5K RPM Heavy Duty; Shared Cooling Design
- 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
- Built-in SAS3 Support via Broadcom 3808; IT Mode
A+ Server 2014TP-HTR
Key Features
- Compute Intensive Applications
- HPC, Data Center, Enterprise Server
- Hyperscale / Hyperconverged
Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
1. Single AMD EPYC™ 7003/7002 Series Processor
(The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer)
2. Up to 2TB ECC 3DS LRDIMM,
up to DDR4-3200MHz; 8 DIMM slots
3. 2 PCI-E 4.0 x16 (LP) slots
4. Flexible Networking support via SIOM;
Dedicated IPMI 2.0 LAN
• Software Out of Band License key
(SFT-OOB-LIC) included for
OOB BIOS management
5. 3 Hot-swap 3.5" SATA3 drive bays
M.2 Interface: 4 SATA/PCI-E 4.0 x4
M.2 Form Factor: 2280, 22110, 2260, 2242
M.2 Key: M-key
6. 2000W Redundant Power Supplies
Titanium Level (96%)
(Full redundancy based on
configuration and application load)
Twin SuperServer SYS-620TP-HC9TR
Key Applications
- High Performance Computing
- Hyper-Converged Infrastructure
- Big Data / Big Science
- Dual Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable Processors
- Intel® C621A Chipset
- 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM
- 1 PCIe 4.0 x16 (LP), 1 PCIe 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22x80 mm)
- Intel® X710 Dual port 10GBase-T LAN onboard
- 3x 3.5" hot-swap SATA/SAS drive bays
- 4 heavy duty 8cm PWM fans with optimal fan speed control (Per System)
- Two 2200W redundant power supplies with PMBus
-
- ASPEED AST2600 BMC, 2 USB, VGA. RoT
- Broadcom® 3908 SAS (12Gbps); 3 slots per node; RAID 0, 1, 5 support.
Twin SuperServer SYS-620TP-HC8TR
Key Applications
- High Performance Computing
- Hyper-Converged Infrastructure
- Big Data / Big Science
- Dual Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable Processors
- Intel® C621A Chipset
- 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM
- 1 PCIe 4.0 x16 (LP), 1 PCIe 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22x80 mm)
- Intel® X710 Dual port 10GBase-T LAN onboard
- 3x 3.5" hot-swap SATA/SAS drive bays
- 4 heavy duty 8cm PWM fans with optimal fan speed control (Per System)
- Two 2200W redundant power supplies with PMBus
-
- Broadcom® 3808 SAS (12Gbps); 3 slots per node; HBA only, no RAID support.
- ASPEED AST2600 BMC, 2 USB, VGA. RoT
Twin SuperServer SYS-220TP-HC9TR
Key Applications
- High Performance Computing
- Hyper-Converged Infrastructure
- Big Data / Big Science
- Dual Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable Processors
- Intel® C621A Chipset
- 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM
- 1 PCIe 4.0 x16 (LP), 1 PCIe 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22x80 mm)
- Intel® X710 Dual port 10GBase-T LAN onboard
- 6x 2.5" hot-swap SATA/SAS drive bays
- 4 heavy duty 8cm PWM fans with optimal fan speed control (Per System)
- Two 2200W redundant power supplies with PMBus
-
- Broadcom® 3908 SAS (12Gbps); 6 slots per node; RAID 0, 1, 5, 6, 10, 50 support.
- ASPEED AST2600 BMC, 2 USB, VGA. RoT
Twin SuperServer SYS-220TP-HC8TR
Key Applications
- High Performance Computing
- Hyper-Converged Infrastructure
- Big Data / Big Science
- Dual Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable Processors
- Intel® C621A Chipset
- 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM
- 1 PCIe 4.0 x16 (LP), 1 PCIe 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22x80 mm)
- Intel® X710 Dual port 10GBase-T LAN onboard
- 6x 2.5" hot-swap SATA/SAS drive bays
- 4 heavy duty 8cm PWM fans with optimal fan speed control (Per System)
- Two 2200W redundant power supplies with PMBus
-
- Broadcom® 3808 SAS (12Gbps); 6 slots per node; HBA only, no RAID support.
- ASPEED AST2600 BMC, 2 USB, VGA. RoT
Twin SuperServer SYS-120TP-DC9TR
Key Applications
- High Performance Computing
- Hyper-Converged Infrastructure
- Big Data / Big Science
- Dual Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable Processors
- Intel® C621A Chipset
- 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM
- 1 PCIe 4.0 x16 (LP), 1 PCIe 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22x80 mm)
- Intel® X710 Dual port 10GBase-T LAN onboard
- 4x 2.5" hot-swap SATA/SAS drive bays
- 6 counter-rotating 4cm PWM fans with optimal fan speed control (Per System)
- Two 1000W redundant power supplies with PMBus
-
- ASPEED AST2600 BMC, 2 USB, VGA. RoT
- Broadcom® 3908 SAS (12Gbps); 4 slots per node; RAID 0, 1, 5, 6, 10 support.