2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡,
Dual UPI up to 10.4GT/s
Support CPU TDP 70-205W
Cores
Up to 28 Cores
Note
‡ BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R) * CPU SKUs not supported: Gold 6256 and Gold 6250(L) (L = increased memory capacity per socket), Gold 6233W and Gold 5216W
System Memory
Memory Capacity
16 DIMM slots
Up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM††
Memory Type
2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note
† 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro †† Cascade Lake only. Contact your Supermicro sales rep for more info.
On-Board Devices
Chipset
Intel® C622 chipset
SATA
SATA3 (6Gbps); RAID 0, 1, 5, 10
Network Controllers
Intel® X722 10GBase-T Ethernet Controller
Virtual Machine Device Queues reduce I/O overhead
Supports 10GBASE-T, 100BASE-TX, and 1000BASE-T, RJ45 output
IPMI
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics
ASPEED AST2500 BMC
Input / Output
SATA
8 SATA3 (6Gbps) ports
LAN
2 RJ45 10GBase-T Ethernet LAN ports
1 RJ45 Dedicated IPMI LAN port
USB
Rear USB: 2 USB 3.0 + 2 USB 2.0
Front USB: 2 USB 2.0
USB Header: 1 Type A
VGA
1 VGA port
Serial Port / Header
2 Fast UART 16550 serial
2 COM Ports (1 rear, 1 header)
DOM
2 SuperDOM (Disk on Module) ports
System BIOS
BIOS Type
AMI UEFI
Management
Software
Intel® Node Manager
IPMI 2.0
KVM with dedicated LAN
SSM, SPM, SUM
SuperDoctor® 5
Watch Dog
Power Configurations
ACPI / APM Power Management
PC Health Monitoring
CPU
Monitors for CPU Cores, Chipset Voltages, Memory.
4+1 Phase-switching voltage regulator
FAN
Fans with tachometer monitoring
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
Temperature
Monitoring for CPU and chassis environment
Thermal Control for fan connectors
Chassis
Form Factor
2U Rackmount
Model
CSE-825TQC-R1K03LPB
Dimensions and Weight
Width
17.2″ (437mm)
Height
3.5″ (89mm)
Depth
25.5″ (647mm)
Package
26.7″ (H) x 11.4″ (W) x 34.5″ (D)
Weight
Net Weight: 35.5 lbs (16.1 kg)
Gross Weight: 69 lbs (31.2 kg)
Available Colors
Black
Front Panel
Buttons
Power On/Off button
System Reset button
UID button
LEDs
Power status LED
HDD activity LED
Network activity LEDs
System information (overheat/UID) LED
Expansion Slots
PCI-Express
4 PCI-E 3.0 x16 (Low-profile)
2 PCI-E 3.0 x8 (Low-profile)
Drive Bays
Hot-swap
8 Hot-swap 3.5″ SATA drive bays
Backplane
2U SAS/SATA backplane
System Cooling
Fans
3 Heavy duty 80mm fans with PWM fan speed control
Power Supply (76mm Width)
1000W Redundant Power Supplies with PMBus
Total Output Power
800W/1000W
Dimension
(W x H x L)
76 x 40 x 336 mm
Input
100-127Vac / 12-9A / 50-60Hz
200-240Vac / 7.2-6A / 50-60Hz
200-240Vdc / 7.2-6A (for CCC only)
+12V
Max: 66.7A / Min. 0A (100-127Vac)
Max: 83A / Min. 0A (200-240Vac)
Max: 83A / Min. 0A (200-240Vdc)
5Vsb
Max: 4A / Min: 0A
Output Type
19 Pairs Gold Finger Connector
Certification
Titanium Level [ Test Report ]
Operating Environment
RoHS
RoHS Compliant
Environmental Spec.
Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
-40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity:
8% to 90% (non-condensing)
Non-operating Relative Humidity:
5% to 95% (non-condensing)
Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series
3 PCIe 4.0 x16 slots with support for GPU/Accelerator cards
Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible)
Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
Intel® C621A Chipset
32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series