2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors‡,
Dual UPI up to 10.4GT/s
Support CPU TDP 70-165W with IVR
Cores
Up to 28 Cores
Note
‡ BIOS version 3.2 or above is required to support 2nd Gen Intel® Xeon® Scalable processors (codenamed Cascade Lake-R)
System Memory (per Node)
Memory Capacity
12 DIMM slots
Up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM
Supports Intel® Optane™ DCPMM††
Memory Type
2933†/2666/2400/2133MHz ECC DDR4 RDIMM/LRDIMM
Note
† 2933MHz in two DIMMs per channel can be achieved by using memory purchased from Supermicro †† Cascade Lake only. Contact your Supermicro sales rep for more info.
On-Board Devices
Chipset
Intel® C621 chipset
SATA
SATA3 (6Gbps); RAID 0, 1, 5, 10
Network Controllers
Flexible networking via SIOM
IPMI
Support for Intelligent Platform Management Interface v.2.0
IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
Graphics
ASPEED AST2500 BMC
Input / Output (per node)
LAN
SIOM flexible Network card
1 RJ45 Dedicated IPMI LAN port (front)
USB
2 USB 3.0 ports (front)
VGA
1 VGA port (front)
System BIOS
BIOS Type
128Mb SPI Flash EEPROM with AMI BIOS
Management
Software
Intel® Node Manager
IPMI 2.0
KVM with dedicated LAN
SuperDoctor® 5
Watch Dog
Power Configurations
ACPI Power Management
PC Health Monitoring
CPU
Monitors for CPU Cores, Chipset Voltages, Memory.
4+1 Phase-switching voltage regulator
FAN
Fans with tachometer monitoring
Status monitor for speed control
Pulse Width Modulated (PWM) fan connectors
Temperature
Monitoring for CPU and chassis environment
Thermal Control for fan connectors
Chassis
Form Factor
4U Rackmount
Model
CSE-F418IF3-R2K20BP
Dimensions and Weight
Width
17.63″ (448mm)
Height
6.96″ (177mm)
Depth
29″ (737mm)
Package
28.3″ (W) x 15.0″ (H) x 42.4″ (D)
Weight
Net Weight: 150 lbs (68.04 kg)
Gross Weight: 200 lbs (90.71 kg)
Available Colors
Black
Front Panel
Buttons
Power On/Off button
UID button
LEDs
Power status LED
Network activity LEDs
Information LED (Fan failure, Overheat)
Expansion Slots (per node)
PCI-Express
1 PCI-E 3.0 x16 (Low-profile)
1 PCI-E 3.0 x8 (Low-profile)
1 PCI-E 3.0 x16 (SIOM)
Drive Bays (per node)
Fixed
2 or 4 Fixed 2.5″ SATA3/NVMe drive bays
M.2
M.2 Interface: 2 SATA/PCI-E 3.0 x4, RAID 0 & 1
M.2 Form Factor: 2260, 2280, 22110
M.2 Key: M-Key
System Cooling
Fans
8x 8cm 13.5k RPM rear fans per enclosure
Power Supply
2200W Redundant Power Supplies with PMBus
Total Output Power and Input
1200W with Input 100-127Vac
1800W with Input 200-220Vac
1980W with Input 220-230Vac
2090W with Input 230-240Vac
2200W with Input 220-240Vac (for UL/cUL use only)
2090W with Input 230-240Vdc (for CCC only)
AC Input Frequency
50-60Hz
Dimension
(W x H x L)
76 x 40 x 336 mm
+12V
Max: 100A / Min: 0A (100-127Vac)
Max: 150A / Min: 0A (200-220Vac)
Max: 165A / Min: 0A (220-230Vac)
Max: 174.17A / Min: 0A (230-240Vac)
Max: 183.3A / Min: 0A (220-240Vac)
5VSB
Max: 1A / Min: 0A
Output Type
Backplanes (gold finger)
Certification
Titanium Level [ Test Report ]
Operating Environment
RoHS
RoHS Compliant
Environmental Spec.
Operating Temperature:
10°C ~ 35°C (50°F ~ 95°F)
Non-operating Temperature:
-40°C to 60°C (-40°F to 140°F)
Operating Relative Humidity:
8% to 90% (non-condensing)
Non-operating Relative Humidity:
5% to 95% (non-condensing)
Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series
3 PCIe 4.0 x16 slots with support for GPU/Accelerator cards
Flexible networking options with 1 AIOM networking slot (OCP NIC 3.0 compatible)