FatTwin(10)

Key Applications - Hyperscale / Hyperconverged - HPC and Big Data - Data Center Enterprise Applications - Scale Out Storage - Telco Data Center - Virtualization Server  Key Features 8 Hot-pluggable System Nodes in a 4U form factor. Each node supports: 1.Single AMD EPYC™ 7003/7002 Series Processor (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 2.Up to 2TB ECC 3DS LRDIMM, up to DDR4-3200MHz; 8 DIMM slots 3.Expansion slots: 1 PCI-E 4.0 x16 (LP Riser), 1 PCI-E 4.0 x16 (for AIOM) 4.AIOM Network card, 1 dedicated IPMI LAN port 5.1 VGA, 2 USB 3.0 ports 6.6 Hot-swap 2.5" drive bays: 2 NVMe/SATA3, 4 SATA3 (optional NVMe with additional cables) M.2 Interface: 4 SATA/PCI-E 4.0 x4 M.2 Form Factor: 2242, 2260, 2280, 22110 M.2 Key: M-Key 7.3x 4cm 17.6K RPM middle fans 8.2200W Redundant Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)

Key Applications

• Hyperscale / Hyperconverged
• HPC and Big Data
• Data Center Enterprise Applications
• Telco Data Center

Key Features Eight hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following:

1. Single Socket E (LGA-4677) Supports 4th/5th Gen Intel® Xeon® Scalable Processor
2. C741 Chipset
3. Two M.2 Internal Drives
4. NVMe/SATA/SAS options
5. AIOM and M.2 support; 2 AIOM card support (PCIe 5.0)
6. Up to 6x SAS/SATA/NVMe Hot Swap 2.5” Drives

Key Applications

• Hyperscale / Hyperconverged
• HPC and Big Data
• Data Center Enterprise Applications
• Telco Data Center

Key Features Four hot-pluggable systems (nodes) in a 4U form factor. Each node supports the following:

1. Single Socket E (LGA-4677) Supports 4th/5th Gen Intel® Xeon® Scalable Processor
2. C741 Chipset
3. Two M.2 Internal Drives
4. NVMe/SATA/SAS options
5. AIOM and M.2 support; 1 AIOM card support (PCIe 5.0)
6. Up to 8x SAS/SATA Hot Swap 3.5” Drives, or up to 6x NVMe Hot Swap 2.5” Drives + 2x SAS/SATA Hot Swap 3.5” Drives

Key Features Hadoop, 4-Node Front I/O Each node supports: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 2 PCI-E 3.0 x8 (LP) slots 4. Dual GbE LAN via Intel® i350 5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port 6. 2 USB 3.0 ports, 1 VGA connector 7. 12 Fixed 3.5" SATA3 Drive Bays Optional 2.5" drives mounted in PCI-E 8. 2000W Redundant Power Supplies Titanium Level (96%)

Key Features 8 Hot-plug System Nodes in 4U Each node supports: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. 1x PCI-E 3.0 x8, 1x PCI-E 2.0 x4, or 2x PCI-E 3.0 x8 (optional) 4. I/O ports: 2 10GBase-T, 1 Built-in video, 2 USB 3.0 ports 5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port 6. 4x 2.5" fixed drives 7. 2000W Redundant Power Supplies Titanium Level (96%)

Key Features 8 Hot-plug System Nodes in 4U Each node supports: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16x DIMM slots 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x8 (Micro Low Profile) 4. I/O ports: 2 GbE ports, 1 Built-in video, 2 USB 3.0 ports 5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) with dedicated LAN port 6. 6x 2.5" Hot-swap SATA or 4x 2.5" Hot-swap SATA + 2x SATA/NVMe hybrid 7. 2x Internal NVMe ports (PCI-E 3.0 x4) 8. 3x heavy duty internal fans 9. 2000W High efficiency (96%) Redundant PSU; Titanium Level

Key Features

•  Compute Intensive Applications
•   Data Center, HPC and Enterprise Applications
•  Hyperscale, Hyperconverged
•  RoT (Root of Trust) support to protect firmware security
•  4U 8 node system, each node:

1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 1 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 (LP), 1 PCI-E 3.0 x16 (for SIOM ) 4. 2 or 4 Fixed 2.5" SATA3/NVMe drive bays, M.2 Interface: 2 SATA/PCI-E 3.0 x4, RAID 0 and 1 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key 5. Dual GbE ports via SIOM Network card, 1 dedicated IPMI LAN port (front) 6. 1 VGA, 2 USB 3.0 ports (front) 7. 8x 8cm 13.5k RPM rear fans per enclosure 8. 2200W Redundant Power Supplies Titanium Level (96% Efficiency)

Key Features 8 Hot-plug System Nodes in 4U Each node supports: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x16 (for SIOM ) 4. 6 Hot-swap 2.5" SAS3/SATA3 or 2 Hot-swap 2.5" SAS3/SATA3 + 4 optional NVMe U.2 M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key 5. SAS3 via Broadcom 3108, HW RAID 6. SIOM Network card, 1 dedicated IPMI LAN port 7. 1 VGA, 2 USB 3.0 ports 8. 3x 4cm 20k RPM middle fans 9. 2200W Redundant Power Supplies Titanium Level (96% Efficiency)

Key Features 4 Hot-plug System Nodes in 4U Front I/O. Each node supports: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 2TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 16 DIMM slots 3. 3 PCI-E 3.0 x16 slots (support 3 Double-width GPU/Xeon Phi cards), 2 PCI-E 3.0 x8 slots 4. Front I/O ports: 2 GbE LAN, 2 USB 3.0 and 1 VGA connector 5. Built-in Server management tool (IPMI 2.0, KVM/media over LAN) w/ dedicated LAN port 6. 2 Hot-swap 3.5" SATA3 HDDs 7. 2000W High efficiency (96%) Redundant PSU; Titanium Level

Key Features 4 Hot-plug System Nodes in 4U Each node supports: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. Expansion slots: 1 PCI-E 3.0 x16 (LP) 1 PCI-E 3.0 x16 (for SIOM ) 4. SIOM Network card, 1 dedicated IPMI LAN port 5. 1 VGA, 2 USB 3.0 ports 6. 8 Hot-swap 3.5" SATA3 or 6 Hot-swap 3.5" SATA3 + 2 NVMe U.2 M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key 7. 2x 8cm 14k RPM middle fans 8. 1200W Redundant Power Supplies Titanium Level (96% Efficiency)