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SuperServer 2029BZ-HNR (Complete System Only)

Key Features - Compute Intensive Application - HPC, Data Center, Enterprise Server - Hyperscale / Hyperconverged Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. 6 Hot-swap 2.5" NVMe drive bays; 2 M.2 SATA3 or NVMe support 5. 1 Carrier Card slot (M.2 support) 6. IPMI 2.0 + KVM with dedicated LAN 7. Video via Aspeed AST2500 BMC 8. 16 Heavy duty 40x56mm fans with optimal fan speed control (4 fans per node) 9. 2600W Redundant Power Supplies Titanium Level (96%)

SuperServer 2029GP-TR

Key Applications - 2D/3D and CAD Applications - Big Data Analytics - Edge Computing - VDI - Cloud Computing - Virtualization Key Features 1. Supports up to 6 GPUs 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 6 PCI-E 3.0 x16 slots (FHFL), 1 PCI-E 3.0 x8 (in x16) slot (LP) 5. 8 Hot-swap 2.5" SAS/SATA drive bays, 2 Hot-swap 2.5" SATA/NVMe drive bays 6. 1 SIOM for flexible Networking 7. 5x 80mm heavy duty fans with optimal fan speed control 8. 2000W (1+1) Redundant Power Supplies Platinum Level (94%)

SuperServer 2029P-C1R

Key Features 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 4 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 slots, support 5 low-profile AOCs 4. 8x 2.5" SAS3 & 8x 2.5" SATA3 Hot-swap Drive Bays, optional DVD-ROM drive, optional support 2 NVMe/SSD/HDD 2.5" fix drives, 1 M.2 support 5. M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key 6. 2x 1GbE LAN ports with Intel® X722 7. Integrated IPMI 2.0 with KVM and Dedicated LAN 8. 2 SuperDOM, 1 VGA, 2 COM, 2 USB 3.0, 4 USB 2.0, 1 Type A 9. 3 Heavy duty 8cm fans with PWM fan speed and cooling zone control 10. 1200W Redundant Power Supplies Titanium Level (96%)

SuperServer 2029P-C1RT

Key Features 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 4 PCI-E 3.0 x16, 1 PCI-E 3.0 x8 slots, support 5 low-profile AOCs 4. 8x 2.5" SAS3 & 8x 2.5" SATA3 Hot-swap Drive Bays, optional DVD-ROM drive, optional support 2 NVMe/SSD/HDD 2.5" fix drives, 1 M.2 support 5. M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key 6. 2x 10GBase-T LAN ports with Intel X722 7. Integrated IPMI 2.0 with KVM and Dedicated LAN 8. 2 SuperDOM, 1 VGA, 2 COM, 2 USB 3.0, 4 USB 2.0, 1 Type A 9. 3 Heavy duty 8cm fans with PWM fan speed and cooling zone control 10. 1200W Redundant Power Supplies Titanium Level (96%)

SuperServer 2029TP-HTR

Key Features - Compute Intensive Application - HPC, Data Center - Enterprise Server - Financial Analysis - Mission-critical applications Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 x16 (LP) slots 4. Flexible Networking support via SIOM; Dedicated IPMI 2.0 LAN 5. 6 Hot-swap 2.5" SATA3 drive bays 6. Up to 2200W Redundant Power Supplies Titanium Level (96%)

SuperServer 5019GP-TT

Key Applications - Edge Computing - Micro Data Center - AI/ML, Deep Learning Training and Inference - Virtualization - Cloud Computing Key Features 1. Supports up to 2 Active/Passive Cooling NVIDIA® GPUs in 1U 2. Single Socket P (LGA 3647) supports 2nd Gen Intel® Xeon® Scalable processor (Cascade Lake/Skylake)‡ 3. 6 DIMMs; up to 1.5TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 slots (support double-width GPU), 1 PCI-E 3.0 x16 low-profile slot (center left) 5. 3 Hot-swap 3.5" SAS/SATA drive bays, 1 slim DVD-ROM drive bay 6. 2x 10GBase-T LAN ports via Intel X550 7. 2 M.2 form factor 2280, supports both M.2 NVMe and SATA SSD 8. 8 Heavy duty 4cm counter-rotating 4cm fans with air shroud & optimal fan speed control 9. 1400W High-efficiency Power Supply Platinum Level (94%+)

SuperServer 6028BT-HNC0R+ (Complete System Only)

Key Features - Hyperscale and Hyperconverged Solutions - Compute Intensive Application - HPC, Data Center - Enterprise Server Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 2 PCI-E 3.0 x16 (LP) slots; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. 3 Hot-swap 3.5" NVMe/SAS3 drive bays 5. SAS3 support via Broadcom 3008; IT mode 6. IPMI 2.0 + KVM with dedicated LAN 7. Video via Aspeed AST2400 BMC 8. 4 heavy duty 8cm PWM fans with air shroud 9. 2200W Redundant Power Supplies Titanium Level (96%) 10. 2 M.2 SATA3 or NVMe support

SuperServer 6029BT-DNC0R (Complete System Only)

Key Applications - Compute Intensive Application - HPC, Data Center, Enterprise Server - Hyperscale / Hyperconverged Key Features Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 x8 slot, 1 PCI-E 3.0 x16, 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. 6 SAS3 or 3 NVMe + 3 SAS3 Hot-swap 3.5" drive bays, 2 internal M.2 NVMe/SATA slots 5. SAS3 support via Broadcom 3008; IT mode 6. IPMI 2.0 + KVM with dedicated LAN 7. Video via Aspeed AST2500 BMC 8. 4 Heavy duty 8cm PWM fans with air shroud 9. 2200W Redundant Power Supplies Titanium Level (96%)

SuperServer 6029BT-HNC0R (Complete System Only)

Key Applications - Compute Intensive Application - HPC, Data Center, Enterprise Server - Hyperscale / Hyperconverged Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. 3 Hot-swap 3.5" NVMe/SAS3 drive bays; 2 M.2 SATA3 or NVMe support 5. SAS3 support via Broadcom 3008; IT mode 6. 1 Carrier Card slot (M.2 support) 7. IPMI 2.0 + KVM with dedicated LAN 8. Video via Aspeed AST2500 BMC 9. 4 Heavy duty 8cm PWM fans with air shroud 10. 2200W Redundant Power Supplies Titanium Level (96%)

SuperServer 6029P-TR

Key Applications

Cloud and Virtualization needs
Compute Intensive Application
Database Processing and Storage
High Availability Storage
Hosting & Application Delivery

Key Features 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 4 PCI-E 3.0 x16, 2 PCI-E 3.0 x8 slots 4. 8 Hot-swap 3.5" SATA3 drive bays; RAID 0, 1, 5, 10 5. Optional DVD-ROM drive, optional support: 2 fixed 2.5" NVMe/SSD/HDD, 1 M.2 support 6. M.2 Interface: PCI-E 3.0 x4 M.2 Form Factor: 2260, 2280, 22110 M.2 Key: M-Key 7. 2x 1GbE LAN ports with Intel® X722 8. 1000W Redundant Power Supplies Titanium Level (96% efficiency)

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