4U GPU Lines(16)

Key Applications - High Performance Computing - AI / Deep Learning  Key Features 1.Supports NVIDIA® HGX™ A100 8-GPU; Highest GPU communication using NVIDIA® NVLINK™ v3.0 + NVIDIA® NVSwitch™; NICs for GPUDirect RDMA (1:1 GPU Ratio) 2.Supports HGX A100 8-GPU 40GB (HBM2) or 80GB (HBM2e) 3.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 4.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 5.8 PCI-E 4.0 x16 via PCI-E switch; 1 PCI-E 4.0 x 16 LP and 1 PCI-E 4.0 x8 LP via CPUs; AIOM Support 6.6 Hot-swap U.2 NVMe 2.5" drive bays (4 via PCI-E switch, 2 via CPU) Up to 10 U.2 NVMe 2.5" drives available with an optional 4 drive bays at rear of system 7.Flexible Networking via AIOM, 1 dedicated IPMI LAN Port 8.4 Hot-swap heavy-duty cooling fans 9.2200W (3+1) Redundant Platinum Level Power Supplies (full redundancy based on configuration and application load); 3000W (2+2) Redundant Titanium Level (96%+) Power Supply option available for upgrade

Key Applications - High Performance Computing - AI / Deep Learning  Key Features 1.Supports NVIDIA® HGX™ A100 8-GPU; Highest GPU communication using NVIDIA® NVLINK™ v3.0 + NVIDIA® NVSwitch™; NICs for GPUDirect RDMA (1:1 GPU Ratio) 2.Supports HGX A100 8-GPU 40GB (HBM2) or 80GB (HBM2e) 3.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 4.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 5.8 PCI-E 4.0 x16 via PCI-E switch; 1 PCI-E 4.0 x 16 LP and 1 PCI-E 4.0 x8 LP via CPUs; AIOM Support 6.6 Hot-swap U.2 NVMe 2.5" drive bays (4 via PCI-E switch, 2 via CPU) Up to 10 U.2 NVMe 2.5" drives available with an optional 4 drive bays at rear of system 7.Flexible Networking via AIOM, 1 dedicated IPMI LAN Port 8.4 Hot-swap heavy-duty cooling fans 9.3000W (2+2) Redundant Titanium Level (96%+) Power Supplies (full redundancy based on configuration and application load)

Key Applications - High Performance Computing - AI / Deep Learning  Key Features 1.Supports AMD Instinct™ MI200 Series Accelerators with AMD Infinity™ Fabric™ GPU-GPU Interconnect, 1:1 GPU-to-NIC ratio 2.Supports MI250 OAM Accelerator with 128GB (HBM2e) and Infinity Interconnect 3.Dual AMD EPYC™ 7003 Series Processors 4.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 5.8 PCI-E 4.0 x16 via PLX 2 PCI-E 4.0 x16 LP via CPUs (for 5U SKU) 6.10 hot-swap 2.5" U.2 NVMe/SATA/SAS hybrid drive bays 7.1 dedicated IPMI LAN Port 8.5 hot-swap heavy-duty cooling fans

Key Applications - AI / Deep Learning - High Performance Computing (HPC) - Cloud Gaming - Molecular Dynamics Simulation  Key Features 1.Supports up to 8 double-width GPUs Direct connect for maximum performance 2.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 3.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 4.9 PCI-E 4.0 x16 (Option: 10 PCI-E 4.0 x16 slots without NVMe devices) 5.Up to 24 Hot-swap 2.5" drive bays. With included hardware: • 2x 2.5" SATA in RAID 1 via onboard Marvell 9230 • 4x 2.5" NVMe (Gen3 only; depends on PCI-E quantity based on #4) RAID controller option available for 24 HDDs 6.2 GbE LAN ports (rear) 7.8 Hot-swap 11.5K RPM cooling fans 8.2000W (2+2) Redundant Power Supplies Titanium Level (96%+) (full redundancy based on configuration and application load)

Key Applications - AI / Deep Learning - High Performance Computing (HPC) - Cloud Gaming - Molecular Dynamics Simulation  Key Features 1.Supports up to 8 double-width GPUs Direct connect for maximum performance 2.Dual AMD EPYC™ 7003/7002 Series Processors 3.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 4.9 PCI-E 4.0 x16 (Option: 10 PCI-E 4.0 x16 slots without NVMe devices) 5.Up to 24 Hot-swap 2.5" drive bays. With included hardware: • 2x 2.5" SATA in RAID 1 via onboard Marvell 9230 • 4x 2.5" NVMe Gen4 (depends on PCI-E quantity based on #4) RAID controller option available for 24 HDDs 6.2 GbE LAN ports (rear) 7.8 Hot-swap 11.5K RPM cooling fans 8.2000W (2+2) Redundant Power Supplies Titanium Level (96%+) (full redundancy based on configuration and application load)

Key Applications

• Artificial Intelligence (AI)
• HPC
• AI / Deep Learning
• Deep Learning/AI/Machine Learning Development

Key Features

1. Dual-Socket, AMD EPYC™ 9004 Series Processors
2. • High density 4U system with NVIDIA® HGX™ H100 8-GPU
   • 8 NVMe for NVIDIA GPUDirect Storage
   • 8 NIC for NVIDIA GPUDirect RDMA (1:1 GPU Ratio)
   • Highest GPU communication using NVIDIA® NVLink®
3. 24 DIMM slots Up to 6TB: 4800 ECC DDR5
4. • 8 PCIe 5.0 x16 LP slots
   • 2 PCIe 5.0 x16 FHHL slots, 2 PCIe 5.0 x16 FHHL slots (optional)
5. 4x 5250W(2+2) Redundant Power Supplies, Titanium Level

Key Applications

• AI / Deep Learning
• High Performance Computing

Key Features

1. • Flexible GPU support: active & passive GPUs
   • Up to 8 direct attached double width, full length GPUs
   • 10 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control
2. Dual-Socket, AMD EPYC™ 9004 Series Processors
3. 24 DIMM Slots, up to 6TB DDR5 memory
4. • up to 4x 2.5" Hot-swap NVMe drive bays
   • 1 M.2  Slot

Key Applications

• AI / Deep Learning
• High Performance Computing

Key Features

1. • Flexible GPU support: active & passive GPUs
   • Single Root Configuration with PCIe Switch for up to 10 double width, full length GPUs
   • 10 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control
2. Single AMD EPYC™ 9004 Series Processors
3. 12 DIMM Slots, up to 3TB DDR5 memory
4. up to 8x 2.5" Hot-swap NVMe drive bays
5. AIOM / OCP 3.0 Support

Key Applications

• AI / Deep Learning
• High Performance Computing

Key Features

1. • Flexible GPU support: active & passive GPUs
   • Dual Root Configuration with PCIe Switch for up to 10 double width, full length GPUs
   • 10 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control
2. Dual-Socket, AMD EPYC™ 9004 Series Processors up to 360W TDP
3. 24 DIMM Slots, up to 6TB DDR5 memory
4. • up to 8x 2.5" Hot-swap NVMe drive bays
   • 1 M.2  Slot
5. AIOM / OCP 3.0 Support

Key Applications

• High Performance Computing
• AI/Deep Learning Training

Key Features

1. Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
2. Intel® C621A Chipset
3. 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series
4. • AIOM/OCP 3.0 Support
   • 10 PCIe Gen 4.0 X16 LP Slots
5. Flexible networking options
6. • 6x 2.5" Hot-swap NVMe/SATA/SAS drive bays
   • 2 M.2 NVMe and SATA for boot drive only
7. 4 heavy duty fans with optimal fan speed control
8. 4x 3000W redundant Titanium level power supplies