TwinPro(14)

Key Features - Compute Intensive Applications - HPC, Data Center, Enterprise Server - Hyperscale / Hyperconverged Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Single AMD EPYC™ 7003/7002 Series Processor (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-3200MHz; 8 DIMM slots 3. 2 PCI-E 4.0 x16 (LP) slots 4. Flexible Networking support via SIOM; Dedicated IPMI 2.0 LAN • Software Out of Band License key (SFT-OOB-LIC) included for OOB BIOS management 5. 3 Hot-swap 3.5" SATA3 drive bays M.2 Interface: 4 SATA/PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110, 2260, 2242 M.2 Key: M-key 6. 2000W Redundant Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)

Key Applications / Features  - Mission-critical applications - High Availability Storage Appliance Platform Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM 3. 2 PCI-E 3.0 x16 slots 4. Flexible Networking support via SIOM; Dedicated IPMI 2.0 LAN 5. 4 Hot-swap 2.5" SAS3 drive bays 6. Broadcom 3008 SAS3 controller; SW RAID 7. 2 SuperDOM onboard or optional 2 M.2 carrier 8. Up to 1000W Redundant Power Supplies Titanium Level (96%)

Key Applications / Features  - Mission-critical applications - High Availability Storage Appliance Platform Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM 3. 2 PCI-E 3.0 x16 slots 4. Flexible Networking support via SIOM; Dedicated IPMI 2.0 LAN 5. 4 Hot-swap 2.5" SATA3 drive bays 6. 2 SuperDOM onboard or optional 2 M.2 carrier 7. Up to 1000W Redundant Power Supplies Titanium Level (96%)

Key Features  - Compute Intensive Application - HPC, Data Center - Enterprise Server - Financial Analysis - Mission-critical applications Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 x16 (LP) slots 4. Flexible Networking support via SIOM; Dedicated IPMI 2.0 LAN 5. 6 Hot-swap 2.5" SATA3 drive bays 6. Up to 2200W Redundant Power Supplies Titanium Level (96%)

Key Applications / Features  - Compute Intensive Application - HPC, Data Center - Enterprise Server - Financial Analysis - Mission-critical applications Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 x16 (LP) slots 4. Flexible Networking support via SIOM; Dedicated IPMI 2.0 LAN 5. 3 Hot-swap 3.5" SATA3 drive bays 6. Up to 2200W Redundant Power Supplies Titanium Level (96%)

Key Applications

• High Performance Computing
• Hyper-Converged Infrastructure
• Big Data / Big Science

Key Features Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:

1. Dual Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable Processors
2. Intel® C621A Chipset
3. 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM
4. 1 PCIe 4.0 x16 (LP), 1 PCIe 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22x80 mm)
5. Intel® X710 Dual port 10GBase-T LAN onboard
6. 4x 2.5" hot-swap SATA/SAS drive bays
7. 6 counter-rotating 4cm PWM fans with optimal fan speed control (Per System)
8. Two 1000W redundant power supplies with PMBus
9. • ASPEED AST2600 BMC, 2 USB, VGA. RoT
   • Broadcom® 3808 SAS (12Gbps); 4 slots per node; HBA only, no RAID support.

Key Applications

• High Performance Computing
• Hyper-Converged Infrastructure
• Big Data / Big Science

Key Features Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:

1. Dual Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable Processors
2. Intel® C621A Chipset
3. 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM
4. 1 PCIe 4.0 x16 (LP), 1 PCIe 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22x80 mm)
5. Intel® X710 Dual port 10GBase-T LAN onboard
6. 4x 2.5" hot-swap SATA/SAS drive bays
7. 6 counter-rotating 4cm PWM fans with optimal fan speed control (Per System)
8. Two 1000W redundant power supplies with PMBus
9. • ASPEED AST2600 BMC, 2 USB, VGA. RoT
   • Broadcom® 3908 SAS (12Gbps); 4 slots per node; RAID 0, 1, 5, 6, 10 support.

Key Applications

• High Performance Computing
• Hyper-Converged Infrastructure
• Big Data / Big Science

Key Features Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following:

1. Dual Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable Processors
2. Intel® C621A Chipset
3. 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM
4. 2 PCIe 4.0 x16 (LP), 1 PCIe 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22x80 mm)
5. Intel® X710 Dual port 10GBase-T LAN onboard
6. 4x 2.5" hot-swap SATA drive bays
7. 6 counter-rotating 4cm PWM fans with optimal fan speed control (Per System)
8. Two 1000W redundant power supplies with PMBus
9. • SATA (6Gbps); 4 slots per node; RAID 0, 1, 5, 10 support.
   • ASPEED AST2600 BMC, 2 USB, VGA. RoT

Key Applications

• High Performance Computing
• Hyper-Converged Infrastructure
• Big Data / Big Science

Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Dual Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable Processors
2. Intel® C621A Chipset
3. 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM
4. 1 PCIe 4.0 x16 (LP), 1 PCIe 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22x80 mm)
5. Intel® X710 Dual port 10GBase-T LAN onboard
6. 6x 2.5" hot-swap SATA/SAS drive bays
7. 4 heavy duty 8cm PWM fans with optimal fan speed control (Per System)
8. Two 2200W redundant power supplies with PMBus
9. • Broadcom® 3808 SAS (12Gbps); 6 slots per node; HBA only, no RAID support.
   • ASPEED AST2600 BMC, 2 USB, VGA. RoT

Key Applications

• High Performance Computing
• Hyper-Converged Infrastructure
• Big Data / Big Science

Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Dual Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable Processors
2. Intel® C621A Chipset
3. 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM
4. 1 PCIe 4.0 x16 (LP), 1 PCIe 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22x80 mm)
5. Intel® X710 Dual port 10GBase-T LAN onboard
6. 6x 2.5" hot-swap SATA/SAS drive bays
7. 4 heavy duty 8cm PWM fans with optimal fan speed control (Per System)
8. Two 2200W redundant power supplies with PMBus
9. • Broadcom® 3908 SAS (12Gbps); 6 slots per node; RAID 0, 1, 5, 6, 10, 50 support.
   • ASPEED AST2600 BMC, 2 USB, VGA. RoT