2U GPU Lines(11)

Key Applications - Media/Video Streaming - AI Inference and Machine Learning - Cloud Gaming - Industrial Automation, Retail, Smart Medical Expert Systems  Key Features Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1.Single AMD EPYC™ 7003/7002 Series Processor (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 2.2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs 3.Up to 6 PCI-E Gen 4 x16 (4 internal, 2 external) slots, 1 PCI-E 4.0 x8 AIOM slot M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 4.Integrated IPMI 2.0 + KVM with dedicated LAN • Software Out of Band License key (SFT-OOB-LIC) included for OOB BIOS management 5.2 front Hot-swap 2.5" U.2 NVMe Gen4 drive bays 6. AST2600 BMC 7.2600W Redundant (1+1) Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)

Key Applications - Media/Video Streaming - AI Inference and Machine Learning - GPU Virtualization (VDI) - Industrial Automation, Retail, Smart Medical Expert Systems  Key Features Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1.AMD Ryzen™ Threadripper™ PRO 5000WX/3000WX Series Processor, up to 64 Cores 2.2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs 3.2 PCI-E Gen 4 x16 external slots, 1 PCI-E 4.0 x8 AIOM slot (or optional x16 AIOM w/ additional parts) M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 4.Integrated IPMI 2.0 + KVM with dedicated LAN • Software Out of Band License key (SFT-OOB-LIC) included for OOB BIOS management 5.2 front Hot-swap 2.5" U.2 NVMe Gen4 drive bays 6. AST2600 BMC 7.2600W Redundant (1+1) Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)

Key Applications - AI/ML, Deep Learning Training and Inference - High-performance Computing (HPC) - Cloud Computing - Research Laboratory/National Laboratory - Autonomous Vehicle Technologies - Molecular Dynamics Simulation  Key Features 1.High Density 2U System with NVIDIA® HGX™ A100 4-GPU; Highest GPU communication using NVIDIA® NVLINK™, 4 NICs for GPUDirect RDMA (1:1 GPU Ratio) 2.Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e) 3.Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink™ v3.0 up to 600GB/s interconnect 4.On board BMC supports integrated IPMI 2.0 + KVM with dedicated 10G LAN 5.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 6.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 7.4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP) 8.4 Hot-swap 2.5" drive bays (SAS/SATA/NVMe Hybrid) 9.2x 2200W Platinum Level power supplies with Smart Power Redundancy

Key Applications - AI/ML, Deep Learning Training and Inference - High-performance Computing (HPC) - Cloud Computing - Research Laboratory/National Laboratory - Autonomous Vehicle Technologies - Molecular Dynamics Simulation  Key Features 1.High Density 2U System with NVIDIA® HGX™ A100 4-GPU; Highest GPU communication using NVIDIA® NVLINK™, 4 NICs for GPUDirect RDMA (1:1 GPU Ratio) 2.Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e) 3.Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink™ v3.0 up to 600GB/s interconnect 4.On board BMC supports integrated IPMI 2.0 + KVM with dedicated 10G LAN 5.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 6.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 7.4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP) 8.4 Hot-swap 2.5" drive bays (SAS/SATA/NVMe Hybrid) 9.3000W Redundant Titanium Level (96%+) Power Supplies (full redundancy based on 40GB HGX A100 4-GPU configuration ONLY and application load)

Key Applications

• High Performance Computing
• AI/Deep Learning Training
• Large Language Model (LLM) Natural Language Processing
• General purpose CPU workloads, including analytics, data science, simulation, HPC, application servers, and more

Key Features  

1. • High density 2U GPU system with up to 2 NVIDIA® PCIe GPUs
   • PCIe-based NVIDIA H100 NVL and NVIDIA L40s
2. Energy-Efficient NVIDIA Grace™ CPU Superchip with 144 Cores
3. Up to 960GB ECC LPDDR5X onboard memory option for minimum latency and maximum power efficiency
4. 5 PCIe 5.0 x16 FHFL Slots
5. 4 E1.S NVMe Storage Support

Key Applications

• High Performance Computing
• AI/Deep Learning Training
• Media/Video Streaming
• Industrial Automation, Retail
• Cloud Gaming

Key Features Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processor
2. Intel® C621A Chipset
3. 2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
4. 3 PCIe Gen 4.0 x16 FHFL DW
5. • 2 front Hot-swap 2.5" U.2 NVMe Gen4 drive bays
   • 2 M.2 NVMe and SATA for boot drive only
6. AST2500 BMC

Key Applications

• Scientific Virtualization
• High Performance Computing
• VDI
• AI/Deep Learning Training

Key Features

1. Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
2. Intel® C621A Chipset
3. 16 DIMM Slots; Up to 4TB DRAM; Up to 4TB Intel® Optane™ Persistent Memory (up to 6TB with DRAM) ; 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series
4. • 6 PCIe Gen 4.0 x16 FH, 10.5" L
   • Up to 2 PCIe Gen 4.0 x8 FH
5. Flexible networking options
6. • Total 10x 2.5" Hot-swap drive bays, configurable combination of SATA + NVMe with optional cable, up to 6x NVMe
   • Configuration 3: 4x SATA + 6x NVMe
   • 2x M.2 NVMe for boot drive only (with optional expansion card AOC-SLG3-2M2)
   • Configuration 1: 8x SATA + 2x NVMe (PCIe slot 7 + slot 8 enabled)
   • Configuration 2: 6x SATA + 4x NVMe (PCIe slot 7 enabled)
7. 5 counter rotating fans w/ Optimal Fan Speed Control
8. 2x 2600W redundant Titanium level power supplies

Key Applications

• High Performance Computing
• AI/Deep Learning Training

Key Features

1. Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
2. Intel® C621A Chipset
3. Up to 4x PCIe Gen 4.0 X16 LP Slots
4. • High density 2U system with NVIDIA® HGX™ A100 4-GPU
   • Highest GPU communication using NVIDIA® NVLINK™
   • Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e)
   • Direct connect PCIe Gen4 Platform with NVIDIA® NVLink™ v3.0 up to 600GB/s interconnect
5. Flexible networking options
6. • 4x 2.5" Hot-swap (SATA/SAS/NVMe) drive bays
   • 2 M.2  NVMe/SATA via Intel® C621A PCH chipset (for boot drive only)
7. 4 heavy duty fans with optimal fan speed control
8. 2x 3000W redundant Titanium level power supplies

Key Applications

• High Performance Computing
• AI/Deep Learning Training
• Large Language Model (LLM) Natural Language Processing

Key Features

1. • High density 2U GPU system with up to 4 NVIDIA® PCIe GPUs
   • Highest GPU communication using NVIDIA® NVLINK™ using
   • PCIe-based H100 NVL with NVLink Support
2. 5th/4th Gen Intel® Xeon® Scalable processor support
3. 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5
4. 7 PCIe 5.0 x16 FHFL Slots
5. NVIDIA BlueField-3 Data Processing Unit Support for the most demanding accelerated computing workloads.
6. 8 E1.S NVMe Storage Support

Key Applications

• High Performance Computing
• AI/Deep Learning Training
• Industrial Automation, Retail
• Healthcare
• Conversational AI
• Business Intelligence & Analytics
• Drug Discovery
• Climate and Weather Modeling
• Finance & Economics

Key Features

1. • Highest GPU communication using NVIDIA® NVLINK™
   • High density 2U system with NVIDIA® HGX™ H100 4-GPU
2. 5th/4th Gen Intel® Xeon® Scalable processor support
3. 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5
4. 4 PCIe Gen 5.0 X16 LP
5. Flexible networking options
6. • 2 M.2 NVMe for boot drive only
   • 4x 2.5" Hot-swap NVMe/SATA3 drive bays
7. • Direct-To-Chip Liquid Cooling solution
   • 4 heavy duty fans with optimal fan speed control
8. 2x 5250W(1+1) Redundant Power Supplies