GrandTwin Distributor in Dubai, UAE, Saudi Arabia, KSA, and Russia - DigitalTech.ae

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GrandTwin A+ Server AS-2115GT-HNTF (Complete System Only)

Key Applications

HPC
Cloud Gaming
MEC (Multi-Access Edge Computing)
Multi-Purpose CDN
High-availability Cache Cluster
Telco Edge Cloud
EDA (Electric Design Automation)
Mission Critical Web Applications

Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

Single-Socket, AMD EPYC™ 9004 Series Processors up to 360W TDP
12 DIMM Slots , up to 3TB DDR5 memory
Flexible bays for either Storage or AIOM / OCP 3.0 slots
Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE
Up to 4 Hot-swap 2.5" NVMe/SATA drives

GrandTwin A+ Server AS-2115GT-HNTR (Complete System Only)

Key Applications

HPC
Cloud Gaming
MEC (Multi-Access Edge Computing)
Multi-Purpose CDN
High-availability Cache Cluster
Telco Edge Cloud
EDA (Electric Design Automation)
Mission Critical Web Applications

Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

Single-Socket, AMD EPYC™ 9004 Series Processors up to 290W TDP
12 DIMM Slots , up to 3TB DDR5 memory
2 AIOM / OCP 3.0 slots
up to 6 Hot-swap 2.5"NVMe/SATA drives

GrandTwin SuperServer SYS-210GT-HNC8F (Complete System Only)

Key Applications

HPC
Cloud Gaming
MEC (Multi-Access Edge Computing)
Multi-Purpose CDN
High-availability Cache Cluster
Telco Edge Cloud
EDA (Electric Design Automation)
Mission Critical Web Applications

Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

Single-Socket, 3rd Gen Intel® Xeon® Scalable processors up to 270W TDP
Intel® C621A
16 DIMM Slots up to 4TB
Optional: AIOM PCIe 4.0 x16 LP (OCP 3.0 compliant)
Two optional storage modules. Each module supports 2x NVMe or SAS/SATA drive bays
2x cooling fans per 2U enclosure, 16.5K RPM Heavy Duty; Shared Cooling Design
2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
Built-in SAS3 Support via Broadcom 3808; IT Mode

GrandTwin SuperServer SYS-210GT-HNTF (Complete System Only)

Key Applications

HPC
Cloud Gaming
MEC (Multi-Access Edge Computing)
Multi-Purpose CDN
High-availability Cache Cluster
Telco Edge Cloud
EDA (Electric Design Automation)
Mission Critical Web Applications

Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

Single-Socket, 3rd Gen Intel® Xeon® Scalable processors up to 270W TDP
Intel® C621A
16 DIMM Slots up to 4TB
Optional: AIOM PCIe 4.0 x16 LP (OCP 3.0 compliant)
Two optional storage modules. Each module supports 2x NVMe or SATA drive bays
2x cooling fans per 2U enclosure, 16.5K RPM Heavy Duty; Shared Cooling Design
2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design

GrandTwin SuperServer SYS-211GT-HNC8F (Complete System Only)

Key Applications

HPC
Cloud Gaming
MEC (Multi-Access Edge Computing)
Multi-Purpose CDN
High-availability Cache Cluster
Telco Edge Cloud
EDA (Electric Design Automation)
Mission Critical Web Applications

Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

Single-Socket, 5th/4th Gen Intel® Xeon® Scalable processors up to 350W TDP
Intel® C741
16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-5600
Optional AIOM module or PCIe 5.0 x16
Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE
Two optional storage modules. Each module supports 2x NVMe or SAS/SATA drive bays
2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
Built-in SAS3 Support via Broadcom 3808; IT Mode

GrandTwin SuperServer SYS-211GT-HNC8R (Complete System Only)

Key Applications

HPC
Cloud Gaming
MEC (Multi-Access Edge Computing)
Multi-Purpose CDN
High-availability Cache Cluster
Telco Edge Cloud
EDA (Electric Design Automation)
Mission Critical Web Applications

Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

Single-Socket, 5th/4th Gen Intel® Xeon® Scalable processors up to 300W TDP
Intel® C741
16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-5600
2 AIOM
6x NVMe/SAS/SATA drive bays
2x cooling fans per 2U enclosure, 16K RPM Heavy Duty; Shared Cooling Design
2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
Built-in SAS3 Support via Broadcom 3808; IT Mode

GrandTwin SuperServer SYS-211GT-HNTF (Complete System Only)

Key Applications

HPC
Cloud Gaming
MEC (Multi-Access Edge Computing)
Multi-Purpose CDN
High-availability Cache Cluster
Telco Edge Cloud
EDA (Electric Design Automation)
Mission Critical Web Applications

Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

Single-Socket, 5th/4th Gen Intel® Xeon® Scalable processors up to 350W TDP
Intel® C741
16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-5600
Optional AIOM module or PCIe 5.0 x16
Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE
Two optional storage modules. Each module supports 2x NVMe or SATA drive bays
2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design

GrandTwin SuperServer SYS-211GT-HNTR (Complete System Only)

Key Applications

HPC
Cloud Gaming
MEC (Multi-Access Edge Computing)
Multi-Purpose CDN
High-availability Cache Cluster
Telco Edge Cloud
EDA (Electric Design Automation)
Mission Critical Web Applications

Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

Single-Socket, 5th/4th Gen Intel® Xeon® Scalable processors up to 300W TDP
Intel® C741
16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-5600
2 AIOM
Up to 6 Hot-swap 2.5" NVMe/SATA drives
2x cooling fans per 2U enclosure, 16K RPM Heavy Duty; Shared Cooling Design
2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design

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