Twin(7)

Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 3. 1x PCI-E 3.0 x16 (LP) slot 4. Single port IB (FDR, 56Gbps), w/ QSFP connector 5. Intel® i350 Dual port GbE LAN 6. 6x 2.5" Hot-swap SATA3 drive bays 7. 1600W Redundant Power Supplies Titanium Level 8. 2x SATA DOM

Key Features Two systems (nodes) in a 1U form factor. Each node supports the following: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 3. 1x PCI-E 3.0 x16 (in x16) slot 4. 2x 3.5" Hot-swap SAS/SATA drive bays 5. Intel® i350 Dual port GbE LAN 6. I/O ports: 2x SuperDOM, 1x VGA, 1x COM, 2x USB 2.0 (rear) 7. 1000W High-efficiency Power Supply Titanium Level Certified

Key Features Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 3. 3x PCI-E 3.0 x8 slots (1x low-profile and 2x FHHL) 4. Intel® i350 Dual port GbE LAN 5. 6x 3.5" Hot-swap SAS2/SATA3 drive bays 6. SAS2 (6Gbps) via Broadcom 2208 7. 1200W Redundant Power Supplies Titanium Level (Updated for 2021 Version)

Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 3. 1x PCI-E 3.0 (x16) low-profile slot 4. Single port IB (FDR, 56Gbps), w/ QSFP connector 5. Intel® i350 Dual port GbE LAN 6. 3x 3.5" Hot-swap SATA3 drive bays 7. 2x SATA DOM 8. 1600W Redundant Power Supplies Titanium Level

Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 1TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 8x DIMM slots 3. 1x PCI-E 3.0 (x16) low-profile slot 4. Intel® i350 Dual port GbE LAN 5. 3x 3.5" Hot-swap SATA3 drive bays 6. 2x SATA DOM 7. 1600W Redundant Power Supplies Titanium Level (96%)

Key Applications / Features  - HPC - Virtualization - Data Center - Web Server Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 8 DIMMs; up to 2TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM 3. 2 PCI-E 3.0 x8 (FH/HL) or 1 PCI-E 3.0 x8 (FH/HL) + 1 PCI-E 3.0 x4 (FH/HL) + 1 PCI-E 3.0 x 4 (LP) (8/8/0 or 8/4/4) 4. Dedicated IPMI 2.0 LAN 5. 6 Hot-swap 3.5" SATA3 drive bays 6. 2 SATA DOM + 1 SATA/NVMe M.2 (22110/2280) 7. Up to 1200W Redundant Power Supplies Titanium Level (96%)

Key Applications / Features - HPC - Data Center - Enterprise Server - Finanical Analysis - Mission-critical applications Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 8 DIMMs; up to 2TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM 3. 1 PCI-E 3.0 x16 (LP) slot 4. Dedicated IPMI 2.0 LAN 5. 3 Hot-swap 3.5" SATA3 drive bays 6. 2 SATA DOM + 1 SATA/NVMe M.2 (22110/2280) 7. Up to 1600W Redundant Power Supplies Titanium Level (96%)