1U GPU Lines(10)

Key Applications

• High Performance Computing
• AI/Deep Learning Training and Inference
• Large Language Model (LLM) and Generative AI

Key Features This system currently supports two E1.S drives direct to the processor and the onboard GPU only. Please consult your Supermicro Salesperson for details. Two nodes in a 1U form factor. Each node supports the following:

1. High density 1U 2-node GPU system with Integrated NVIDIA® H100 GPU (1 per Node)
2. NVIDIA Grace Hopper™ Superchip (Grace CPU and H100 GPU)
3. NVLink® Chip-2-Chip (C2C) high-bandwidth, low-latency interconnect between CPU and GPU at 900GB/s
4. Up to 576GB of coherent memory per node including 480GB LPDDR5X and 96GB of HBM3 for LLM applications
5. 2x PCIe 5.0 x16 slots per node supporting NVIDIA BlueField®-3 or ConnectX®-7
6. 7 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control
7. This system supports two E1.S drives directly from the processor only.

Key Applications

• High Performance Computing
• AI/Deep Learning Training and Inference
• Large Language Model (LLM) and Generative AI

Key Features This system currently supports two E1.S drives direct to the processor and the onboard GPU only. Please consult your Supermicro Salesperson for details. 

1. High density 1U GPU system with Integrated NVIDIA® H100 GPU
2. NVIDIA Grace Hopper™ Superchip (Grace CPU and H100 GPU)
3. NVLink® Chip-2-Chip (C2C) high-bandwidth, low-latency interconnect between CPU and GPU at 900GB/s
4. Up to 576GB of coherent memory per node including 480GB LPDDR5X and 96GB of HBM3 for LLM applications
5. 2x PCIe 5.0 x16 slots supporting NVIDIA BlueField®-3 or ConnectX®-7
6. 9 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control
7. This system supports two E1.S drives directly from the processor only.

Key Applications

• High Performance Computing
• AI/Deep Learning Training and Inference
• Large Language Model (LLM) and Generative AI

Key Features This system currently supports two E1.S drives direct to the processor and the onboard GPU only. Please consult your Supermicro Salesperson for details. 

1. High density 1U GPU system with Integrated NVIDIA® H100 GPU and liquid cooling
2. NVIDIA Grace Hopper™ Superchip (Grace CPU and H100 GPU)
3. NVLink® Chip-2-Chip (C2C) high-bandwidth, low-latency interconnect between CPU and GPU at 900GB/s
4. Up to 576GB of coherent memory per node including 480GB LPDDR5X and 96GB of HBM3 for LLM applications
5. 2x PCIe 5.0 x16 slots supporting NVIDIA BlueField®-3 or ConnectX®-7
6. 7 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control
7. This system supports two E1.S drives directly from the processor only.

Key Applications

• High Performance Computing
• Hyperscale Cloud Applications
• Data Analytics

Key Features Pending a firmware fix, this system currently supports four E1.S drives and two GPUs. Please consult your Supermicro Salesperson for details. Two nodes in a 1U form factor. Each node supports the following:

1. High density 1U 2-node system with NVIDIA Grace™ CPU Superchip per node
2. NVLink® Chip-2-Chip (C2C) high-bandwidth, low-latency interconnect between CPU and CPU at 900GB/s
3. Up to 480GB LPDDR5X onboard memory
4. 2x PCIe 5.0 x16 slots per node supporting NVIDIA BlueField®-3 or ConnectX®-7
5. Up to 4x Hot-swap E1.S drives and 2x M.2 NVMe drives per node
6. 7 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control
7. Pending a firmware fix, this system currently supports four E1.S drives and two GPUs. Please consult your Supermicro Salesperson for details.

Key Applications

• Scientific Virtualization
• High Performance Computing
• Rendering
• AI/Deep Learning Training

Key Features

1. Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
2. Intel® C621A Chipset
3. 16 DIMM Slots; Up to 4TB DRAM; Up to 4TB Intel® Optane™ Persistent Memory (up to 6TB with DRAM) ; 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series
4. 6 PCIe Gen 4.0 x16 (4 FHFL & 2 LP)
5. • 2x 2.5" SATA Internal Fixed drive bays
   • 1 M.2 NVMe for boot drive only
   • 2x 2.5" NVMe/SATA Hot-swap drive bays
6. 9 counter rotating fans w/ Optimal Fan Speed Control
7. 2x 2000W redundant Titanium level power supplies

Key Applications  - Edge Computing - Micro Data Center - AI/ML, Deep Learning Training and Inference - Virtualization - Cloud Computing  Key Features 1. Supports up to 2 Active/Passive Cooling NVIDIA® GPUs in 1U 2. Single Socket P (LGA 3647) supports 2nd Gen Intel® Xeon® Scalable processor (Cascade Lake/Skylake)‡ 3. 6 DIMMs; up to 1.5TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 slots (support double-width GPU), 1 PCI-E 3.0 x16 low-profile slot (center right) 5. 6 Hot-swap 2.5" SAS/SATA drive bays 6. 2x 10GBase-T LAN ports via Intel X550 7. 2 M.2 form factor 2280, supports both M.2 NVMe and SATA SSD 8. 8 Heavy duty 4cm counter-rotating 4cm fans with air shroud & optimal fan speed control 9. 1400W High-efficiency Power Supply Platinum Level (94%+)

Key Applications - 3D/2D and CAD Applications - Cloud Computing - Edge Computing - Oil and Gas Exploration - VDI - AI/ML, Deep Learning Training and Inference  Key Features 1. Supports 3x double width GPU or 4 single width GPUs; Support for passively cooled GPUs 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 4 PCI-E 3.0 x16 (FHFL) slots, 1 PCI-E 3.0 x8 (in x16, LP) slots 5. 2 Hot-swap 2.5" SAS/SATA drive bays, 2 Hot-swap 2.5" SATA/NVMe drive bays 6. 1 SIOM for flexible Networking 7. 10 Counter rotating fans with optimal fan speed control 8. 1600W Redundant Power Supplies Platinum Level (94%)

Key Applications - Edge Computing - Micro Data Center - AI/ML, Deep Learning Training and Inference - Virtualization - Cloud Computing  Key Features 1. Supports up to 4 Active/Passive Cooling NVIDIA® GPUs in 1U 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 4 PCI-E 3.0 x16 (FHFL), 1 PCI-E 3.0 x16 (LP) and 1 PCI-E 3.0 x8 (LP) 5. 2 Hot-swap 2.5" U.2 NVMe drive bays, 2 Internal 2.5" SATA drive bays 6. Support 1x M.2 2242/2260/2280, Support M.2 SATA and NVMe 7. 2x 10GBase-T LAN ports via Intel X540 8. 9 Heavy duty 4cm counter-rotating fans with air shroud & optimal fan speed control 9. 2000W Redundant Power Supplies Titanium Level (96%)

Key Applications - Edge Computing - Micro Data Center - AI/ML, Deep Learning Training and Inference - Virtualization - Cloud Computing  Key Features 1. Supports up to 4 Active/Passive Cooling NVIDIA® GPUs in 1U 2. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 3. 12 DIMMs; up to 3TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 4 PCI-E 3.0 x16 (FHFL) slots, 2 PCI-E 3.0 x16 (LP) slots 5. 2 Hot-swap 2.5" SAS/SATA drive bays, 2 Internal 2.5" SATA drive bays 6. Support 1x M.2 2242/2260/2280, Support M.2 SATA and NVMe 7. 2x 10GBase-T LAN ports via Intel X540 8. 9 Heavy duty 4cm counter-rotating fans with air shroud & optimal fan speed control 9. 2000W Redundant Power Supplies Titanium Level (96%)

Key Applications  - Edge Computing - Micro Data Center - AI/ML, Deep Learning Training and Inference - Virtualization - Cloud Computing  Key Features 1. Supports up to 2 Active/Passive Cooling NVIDIA® GPUs in 1U 2. Single Socket P (LGA 3647) supports 2nd Gen Intel® Xeon® Scalable processor (Cascade Lake/Skylake)‡ 3. 6 DIMMs; up to 1.5TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 4. 2 PCI-E 3.0 x16 slots (support double-width GPU), 1 PCI-E 3.0 x16 low-profile slot (center left) 5. 3 Hot-swap 3.5" SAS/SATA drive bays, 1 slim DVD-ROM drive bay 6. 2x 10GBase-T LAN ports via Intel X550 7. 2 M.2 form factor 2280, supports both M.2 NVMe and SATA SSD 8. 8 Heavy duty 4cm counter-rotating 4cm fans with air shroud & optimal fan speed control 9. 1400W High-efficiency Power Supply Platinum Level (94%+)