GPU Servers(42)

Key Applications - Media/Video Streaming - AI Inference and Machine Learning - Cloud Gaming - Industrial Automation, Retail, Smart Medical Expert Systems  Key Features Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1.Single AMD EPYC™ 7003/7002 Series Processor (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 2.2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs 3.Up to 6 PCI-E Gen 4 x16 (4 internal, 2 external) slots, 1 PCI-E 4.0 x8 AIOM slot M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 4.Integrated IPMI 2.0 + KVM with dedicated LAN • Software Out of Band License key (SFT-OOB-LIC) included for OOB BIOS management 5.2 front Hot-swap 2.5" U.2 NVMe Gen4 drive bays 6. AST2600 BMC 7.2600W Redundant (1+1) Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)

Key Applications - Media/Video Streaming - AI Inference and Machine Learning - GPU Virtualization (VDI) - Industrial Automation, Retail, Smart Medical Expert Systems  Key Features Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1.AMD Ryzen™ Threadripper™ PRO 5000WX/3000WX Series Processor, up to 64 Cores 2.2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs 3.2 PCI-E Gen 4 x16 external slots, 1 PCI-E 4.0 x8 AIOM slot (or optional x16 AIOM w/ additional parts) M.2 Interface: 2 PCI-E 4.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 4.Integrated IPMI 2.0 + KVM with dedicated LAN • Software Out of Band License key (SFT-OOB-LIC) included for OOB BIOS management 5.2 front Hot-swap 2.5" U.2 NVMe Gen4 drive bays 6. AST2600 BMC 7.2600W Redundant (1+1) Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)

Key Applications - AI/ML, Deep Learning Training and Inference - High-performance Computing (HPC) - Cloud Computing - Research Laboratory/National Laboratory - Autonomous Vehicle Technologies - Molecular Dynamics Simulation  Key Features 1.High Density 2U System with NVIDIA® HGX™ A100 4-GPU; Highest GPU communication using NVIDIA® NVLINK™, 4 NICs for GPUDirect RDMA (1:1 GPU Ratio) 2.Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e) 3.Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink™ v3.0 up to 600GB/s interconnect 4.On board BMC supports integrated IPMI 2.0 + KVM with dedicated 10G LAN 5.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 6.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 7.4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP) 8.4 Hot-swap 2.5" drive bays (SAS/SATA/NVMe Hybrid) 9.2x 2200W Platinum Level power supplies with Smart Power Redundancy

Key Applications - AI/ML, Deep Learning Training and Inference - High-performance Computing (HPC) - Cloud Computing - Research Laboratory/National Laboratory - Autonomous Vehicle Technologies - Molecular Dynamics Simulation  Key Features 1.High Density 2U System with NVIDIA® HGX™ A100 4-GPU; Highest GPU communication using NVIDIA® NVLINK™, 4 NICs for GPUDirect RDMA (1:1 GPU Ratio) 2.Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e) 3.Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink™ v3.0 up to 600GB/s interconnect 4.On board BMC supports integrated IPMI 2.0 + KVM with dedicated 10G LAN 5.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 6.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 7.4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP) 8.4 Hot-swap 2.5" drive bays (SAS/SATA/NVMe Hybrid) 9.3000W Redundant Titanium Level (96%+) Power Supplies (full redundancy based on 40GB HGX A100 4-GPU configuration ONLY and application load)

Key Applications - High Performance Computing - AI / Deep Learning  Key Features 1.Supports NVIDIA® HGX™ A100 8-GPU; Highest GPU communication using NVIDIA® NVLINK™ v3.0 + NVIDIA® NVSwitch™; NICs for GPUDirect RDMA (1:1 GPU Ratio) 2.Supports HGX A100 8-GPU 40GB (HBM2) or 80GB (HBM2e) 3.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 4.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 5.8 PCI-E 4.0 x16 via PCI-E switch; 1 PCI-E 4.0 x 16 LP and 1 PCI-E 4.0 x8 LP via CPUs; AIOM Support 6.6 Hot-swap U.2 NVMe 2.5" drive bays (4 via PCI-E switch, 2 via CPU) Up to 10 U.2 NVMe 2.5" drives available with an optional 4 drive bays at rear of system 7.Flexible Networking via AIOM, 1 dedicated IPMI LAN Port 8.4 Hot-swap heavy-duty cooling fans 9.2200W (3+1) Redundant Platinum Level Power Supplies (full redundancy based on configuration and application load); 3000W (2+2) Redundant Titanium Level (96%+) Power Supply option available for upgrade

Key Applications - High Performance Computing - AI / Deep Learning  Key Features 1.Supports NVIDIA® HGX™ A100 8-GPU; Highest GPU communication using NVIDIA® NVLINK™ v3.0 + NVIDIA® NVSwitch™; NICs for GPUDirect RDMA (1:1 GPU Ratio) 2.Supports HGX A100 8-GPU 40GB (HBM2) or 80GB (HBM2e) 3.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 4.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 5.8 PCI-E 4.0 x16 via PCI-E switch; 1 PCI-E 4.0 x 16 LP and 1 PCI-E 4.0 x8 LP via CPUs; AIOM Support 6.6 Hot-swap U.2 NVMe 2.5" drive bays (4 via PCI-E switch, 2 via CPU) Up to 10 U.2 NVMe 2.5" drives available with an optional 4 drive bays at rear of system 7.Flexible Networking via AIOM, 1 dedicated IPMI LAN Port 8.4 Hot-swap heavy-duty cooling fans 9.3000W (2+2) Redundant Titanium Level (96%+) Power Supplies (full redundancy based on configuration and application load)

Key Applications - High Performance Computing - AI / Deep Learning  Key Features 1.Supports AMD Instinct™ MI200 Series Accelerators with AMD Infinity™ Fabric™ GPU-GPU Interconnect, 1:1 GPU-to-NIC ratio 2.Supports MI250 OAM Accelerator with 128GB (HBM2e) and Infinity Interconnect 3.Dual AMD EPYC™ 7003 Series Processors 4.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 5.8 PCI-E 4.0 x16 via PLX 2 PCI-E 4.0 x16 LP via CPUs (for 5U SKU) 6.10 hot-swap 2.5" U.2 NVMe/SATA/SAS hybrid drive bays 7.1 dedicated IPMI LAN Port 8.5 hot-swap heavy-duty cooling fans

Key Applications - AI / Deep Learning - High Performance Computing (HPC) - Cloud Gaming - Molecular Dynamics Simulation  Key Features 1.Supports up to 8 double-width GPUs Direct connect for maximum performance 2.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 3.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 4.9 PCI-E 4.0 x16 (Option: 10 PCI-E 4.0 x16 slots without NVMe devices) 5.Up to 24 Hot-swap 2.5" drive bays. With included hardware: • 2x 2.5" SATA in RAID 1 via onboard Marvell 9230 • 4x 2.5" NVMe (Gen3 only; depends on PCI-E quantity based on #4) RAID controller option available for 24 HDDs 6.2 GbE LAN ports (rear) 7.8 Hot-swap 11.5K RPM cooling fans 8.2000W (2+2) Redundant Power Supplies Titanium Level (96%+) (full redundancy based on configuration and application load)

Key Applications - AI / Deep Learning - High Performance Computing (HPC) - Cloud Gaming - Molecular Dynamics Simulation  Key Features 1.Supports up to 8 double-width GPUs Direct connect for maximum performance 2.Dual AMD EPYC™ 7003/7002 Series Processors 3.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 4.9 PCI-E 4.0 x16 (Option: 10 PCI-E 4.0 x16 slots without NVMe devices) 5.Up to 24 Hot-swap 2.5" drive bays. With included hardware: • 2x 2.5" SATA in RAID 1 via onboard Marvell 9230 • 4x 2.5" NVMe Gen4 (depends on PCI-E quantity based on #4) RAID controller option available for 24 HDDs 6.2 GbE LAN ports (rear) 7.8 Hot-swap 11.5K RPM cooling fans 8.2000W (2+2) Redundant Power Supplies Titanium Level (96%+) (full redundancy based on configuration and application load)

Key Applications

• Computer Vision
• Natural Language Processing
• Recommendation
• Purpose Built for AI/Deep Learning Training

Key Features

1. Dual Intel® Xeon® 3rd Gen Scalable Processors (Ice Lake) TDP up to 270W
2. Intel® C621A Chipset
3. 32x DIMM slots, up to 8TB Registered ECC DDR4 3200MHz SDRAM
4. 2x PCIe 4.0 x16 FHFL slot and 2x PCIe 4.0 x8 FHFL slot
5. 6x 400GbE QSFP-DD for scale-out and 1x 1GbE BaseT (dedicated IPMI port)
6. • 4x 2.5”NVMe Hot-Swap Drive Bays
   • Up to 8x 2.5" SATA Hot-Swap Drive Bays
   • Up to 16x 2.5" SATA Hot-Swap Drive Bays (Additional SAOC is required)
7. 12x Removable Heavy-Duty FANs (Includes 2x Dummy PSU FAN)
8. 6x 3000W(54V+12V) Redundant Power Supplies, Titanium Level