Supermicro(358)

Key Applications - AI/ML, Deep Learning Training and Inference - High-performance Computing (HPC) - Cloud Computing - Research Laboratory/National Laboratory - Autonomous Vehicle Technologies - Molecular Dynamics Simulation  Key Features 1.High Density 2U System with NVIDIA® HGX™ A100 4-GPU; Highest GPU communication using NVIDIA® NVLINK™, 4 NICs for GPUDirect RDMA (1:1 GPU Ratio) 2.Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e) 3.Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink™ v3.0 up to 600GB/s interconnect 4.On board BMC supports integrated IPMI 2.0 + KVM with dedicated 10G LAN 5.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 6.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 7.4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP) 8.4 Hot-swap 2.5" drive bays (SAS/SATA/NVMe Hybrid) 9.2x 2200W Platinum Level power supplies with Smart Power Redundancy

Key Applications - AI/ML, Deep Learning Training and Inference - High-performance Computing (HPC) - Cloud Computing - Research Laboratory/National Laboratory - Autonomous Vehicle Technologies - Molecular Dynamics Simulation  Key Features 1.High Density 2U System with NVIDIA® HGX™ A100 4-GPU; Highest GPU communication using NVIDIA® NVLINK™, 4 NICs for GPUDirect RDMA (1:1 GPU Ratio) 2.Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e) 3.Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink™ v3.0 up to 600GB/s interconnect 4.On board BMC supports integrated IPMI 2.0 + KVM with dedicated 10G LAN 5.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 6.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 7.4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP) 8.4 Hot-swap 2.5" drive bays (SAS/SATA/NVMe Hybrid) 9.3000W Redundant Titanium Level (96%+) Power Supplies (full redundancy based on 40GB HGX A100 4-GPU configuration ONLY and application load)

Key Applications - High Performance Computing - AI / Deep Learning  Key Features 1.Supports NVIDIA® HGX™ A100 8-GPU; Highest GPU communication using NVIDIA® NVLINK™ v3.0 + NVIDIA® NVSwitch™; NICs for GPUDirect RDMA (1:1 GPU Ratio) 2.Supports HGX A100 8-GPU 40GB (HBM2) or 80GB (HBM2e) 3.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 4.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 5.8 PCI-E 4.0 x16 via PCI-E switch; 1 PCI-E 4.0 x 16 LP and 1 PCI-E 4.0 x8 LP via CPUs; AIOM Support 6.6 Hot-swap U.2 NVMe 2.5" drive bays (4 via PCI-E switch, 2 via CPU) Up to 10 U.2 NVMe 2.5" drives available with an optional 4 drive bays at rear of system 7.Flexible Networking via AIOM, 1 dedicated IPMI LAN Port 8.4 Hot-swap heavy-duty cooling fans 9.2200W (3+1) Redundant Platinum Level Power Supplies (full redundancy based on configuration and application load); 3000W (2+2) Redundant Titanium Level (96%+) Power Supply option available for upgrade

Key Applications - High Performance Computing - AI / Deep Learning  Key Features 1.Supports NVIDIA® HGX™ A100 8-GPU; Highest GPU communication using NVIDIA® NVLINK™ v3.0 + NVIDIA® NVSwitch™; NICs for GPUDirect RDMA (1:1 GPU Ratio) 2.Supports HGX A100 8-GPU 40GB (HBM2) or 80GB (HBM2e) 3.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 4.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 5.8 PCI-E 4.0 x16 via PCI-E switch; 1 PCI-E 4.0 x 16 LP and 1 PCI-E 4.0 x8 LP via CPUs; AIOM Support 6.6 Hot-swap U.2 NVMe 2.5" drive bays (4 via PCI-E switch, 2 via CPU) Up to 10 U.2 NVMe 2.5" drives available with an optional 4 drive bays at rear of system 7.Flexible Networking via AIOM, 1 dedicated IPMI LAN Port 8.4 Hot-swap heavy-duty cooling fans 9.3000W (2+2) Redundant Titanium Level (96%+) Power Supplies (full redundancy based on configuration and application load)

Key Applications - High Performance Computing - AI / Deep Learning  Key Features 1.Supports AMD Instinct™ MI200 Series Accelerators with AMD Infinity™ Fabric™ GPU-GPU Interconnect, 1:1 GPU-to-NIC ratio 2.Supports MI250 OAM Accelerator with 128GB (HBM2e) and Infinity Interconnect 3.Dual AMD EPYC™ 7003 Series Processors 4.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 5.8 PCI-E 4.0 x16 via PLX 2 PCI-E 4.0 x16 LP via CPUs (for 5U SKU) 6.10 hot-swap 2.5" U.2 NVMe/SATA/SAS hybrid drive bays 7.1 dedicated IPMI LAN Port 8.5 hot-swap heavy-duty cooling fans

Key Applications - AI / Deep Learning - High Performance Computing (HPC) - Cloud Gaming - Molecular Dynamics Simulation  Key Features 1.Supports up to 8 double-width GPUs Direct connect for maximum performance 2.Dual AMD EPYC™ 7003/7002 Series Processors (The latest AMD EPYC™ 7003 Series Processor with AMD 3D V-Cache™ Technology requires BIOS version 2.3 or newer) 3.8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs 4.9 PCI-E 4.0 x16 (Option: 10 PCI-E 4.0 x16 slots without NVMe devices) 5.Up to 24 Hot-swap 2.5" drive bays. With included hardware: • 2x 2.5" SATA in RAID 1 via onboard Marvell 9230 • 4x 2.5" NVMe (Gen3 only; depends on PCI-E quantity based on #4) RAID controller option available for 24 HDDs 6.2 GbE LAN ports (rear) 7.8 Hot-swap 11.5K RPM cooling fans 8.2000W (2+2) Redundant Power Supplies Titanium Level (96%+) (full redundancy based on configuration and application load)