GPU Servers(44)

Key Applications

• High Performance Computing
• AI/Deep Learning Training and Inference
• Large Language Model (LLM) and Generative AI

Key Features This system currently supports two E1.S drives direct to the processor and the onboard GPU only. Please consult your Supermicro Salesperson for details. 

1. High density 1U GPU system with Integrated NVIDIA® H100 GPU and liquid cooling
2. NVIDIA Grace Hopper™ Superchip (Grace CPU and H100 GPU)
3. NVLink® Chip-2-Chip (C2C) high-bandwidth, low-latency interconnect between CPU and GPU at 900GB/s
4. Up to 576GB of coherent memory per node including 480GB LPDDR5X and 96GB of HBM3 for LLM applications
5. 2x PCIe 5.0 x16 slots supporting NVIDIA BlueField®-3 or ConnectX®-7
6. 7 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control
7. This system supports two E1.S drives directly from the processor only.

Key Applications

• High Performance Computing
• Hyperscale Cloud Applications
• Data Analytics

Key Features Pending a firmware fix, this system currently supports four E1.S drives and two GPUs. Please consult your Supermicro Salesperson for details. Two nodes in a 1U form factor. Each node supports the following:

1. High density 1U 2-node system with NVIDIA Grace™ CPU Superchip per node
2. NVLink® Chip-2-Chip (C2C) high-bandwidth, low-latency interconnect between CPU and CPU at 900GB/s
3. Up to 480GB LPDDR5X onboard memory
4. 2x PCIe 5.0 x16 slots per node supporting NVIDIA BlueField®-3 or ConnectX®-7
5. Up to 4x Hot-swap E1.S drives and 2x M.2 NVMe drives per node
6. 7 Hot-Swap Heavy Duty Fans with Optimal Fan Speed Control
7. Pending a firmware fix, this system currently supports four E1.S drives and two GPUs. Please consult your Supermicro Salesperson for details.

Key Applications

• High Performance Computing
• AI/Deep Learning Training
• Large Language Model (LLM) Natural Language Processing
• General purpose CPU workloads, including analytics, data science, simulation, HPC, application servers, and more

Key Features  

1. • High density 2U GPU system with up to 2 NVIDIA® PCIe GPUs
   • PCIe-based NVIDIA H100 NVL and NVIDIA L40s
2. Energy-Efficient NVIDIA Grace™ CPU Superchip with 144 Cores
3. Up to 960GB ECC LPDDR5X onboard memory option for minimum latency and maximum power efficiency
4. 5 PCIe 5.0 x16 FHFL Slots
5. 4 E1.S NVMe Storage Support

Key Applications

• Scientific Virtualization
• High Performance Computing
• Rendering
• AI/Deep Learning Training

Key Features

1. Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
2. Intel® C621A Chipset
3. 16 DIMM Slots; Up to 4TB DRAM; Up to 4TB Intel® Optane™ Persistent Memory (up to 6TB with DRAM) ; 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series
4. 6 PCIe Gen 4.0 x16 (4 FHFL & 2 LP)
5. • 2x 2.5" SATA Internal Fixed drive bays
   • 1 M.2 NVMe for boot drive only
   • 2x 2.5" NVMe/SATA Hot-swap drive bays
6. 9 counter rotating fans w/ Optimal Fan Speed Control
7. 2x 2000W redundant Titanium level power supplies

Key Applications

• High Performance Computing
• AI/Deep Learning Training
• Media/Video Streaming
• Industrial Automation, Retail
• Cloud Gaming

Key Features Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Single Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processor
2. Intel® C621A Chipset
3. 2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
4. 3 PCIe Gen 4.0 x16 FHFL DW
5. • 2 front Hot-swap 2.5" U.2 NVMe Gen4 drive bays
   • 2 M.2 NVMe and SATA for boot drive only
6. AST2500 BMC

Key Applications

• Scientific Virtualization
• High Performance Computing
• VDI
• AI/Deep Learning Training

Key Features

1. Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
2. Intel® C621A Chipset
3. 16 DIMM Slots; Up to 4TB DRAM; Up to 4TB Intel® Optane™ Persistent Memory (up to 6TB with DRAM) ; 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series
4. • 6 PCIe Gen 4.0 x16 FH, 10.5" L
   • Up to 2 PCIe Gen 4.0 x8 FH
5. Flexible networking options
6. • Total 10x 2.5" Hot-swap drive bays, configurable combination of SATA + NVMe with optional cable, up to 6x NVMe
   • Configuration 3: 4x SATA + 6x NVMe
   • 2x M.2 NVMe for boot drive only (with optional expansion card AOC-SLG3-2M2)
   • Configuration 1: 8x SATA + 2x NVMe (PCIe slot 7 + slot 8 enabled)
   • Configuration 2: 6x SATA + 4x NVMe (PCIe slot 7 enabled)
7. 5 counter rotating fans w/ Optimal Fan Speed Control
8. 2x 2600W redundant Titanium level power supplies

Key Applications

• High Performance Computing
• AI/Deep Learning Training

Key Features

1. Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
2. Intel® C621A Chipset
3. Up to 4x PCIe Gen 4.0 X16 LP Slots
4. • High density 2U system with NVIDIA® HGX™ A100 4-GPU
   • Highest GPU communication using NVIDIA® NVLINK™
   • Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e)
   • Direct connect PCIe Gen4 Platform with NVIDIA® NVLink™ v3.0 up to 600GB/s interconnect
5. Flexible networking options
6. • 4x 2.5" Hot-swap (SATA/SAS/NVMe) drive bays
   • 2 M.2  NVMe/SATA via Intel® C621A PCH chipset (for boot drive only)
7. 4 heavy duty fans with optimal fan speed control
8. 2x 3000W redundant Titanium level power supplies

Key Applications

• High Performance Computing
• AI/Deep Learning Training
• Large Language Model (LLM) Natural Language Processing

Key Features

1. • High density 2U GPU system with up to 4 NVIDIA® PCIe GPUs
   • Highest GPU communication using NVIDIA® NVLINK™ using
   • PCIe-based H100 NVL with NVLink Support
2. 5th/4th Gen Intel® Xeon® Scalable processor support
3. 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5
4. 7 PCIe 5.0 x16 FHFL Slots
5. NVIDIA BlueField-3 Data Processing Unit Support for the most demanding accelerated computing workloads.
6. 8 E1.S NVMe Storage Support

Key Applications

• High Performance Computing
• AI/Deep Learning Training
• Industrial Automation, Retail
• Healthcare
• Conversational AI
• Business Intelligence & Analytics
• Drug Discovery
• Climate and Weather Modeling
• Finance & Economics

Key Features

1. • Highest GPU communication using NVIDIA® NVLINK™
   • High density 2U system with NVIDIA® HGX™ H100 4-GPU
2. 5th/4th Gen Intel® Xeon® Scalable processor support
3. 32 DIMM slots Up to 8TB: 32x 256 GB DRAM Memory Type: 5600MTs ECC DDR5
4. 4 PCIe Gen 5.0 X16 LP
5. Flexible networking options
6. • 2 M.2 NVMe for boot drive only
   • 4x 2.5" Hot-swap NVMe/SATA3 drive bays
7. • Direct-To-Chip Liquid Cooling solution
   • 4 heavy duty fans with optimal fan speed control
8. 2x 5250W(1+1) Redundant Power Supplies

Key Applications

• High Performance Computing
• AI/Deep Learning Training

Key Features

1. Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
2. Intel® C621A Chipset
3. 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series
4. • AIOM/OCP 3.0 Support
   • 10 PCIe Gen 4.0 X16 LP Slots
5. Flexible networking options
6. • 6x 2.5" Hot-swap NVMe/SATA/SAS drive bays
   • 2 M.2 NVMe and SATA for boot drive only
7. 4 heavy duty fans with optimal fan speed control
8. 4x 3000W redundant Titanium level power supplies