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Home>Supermicro>Servers & Storage>Rackmount Servers>Page 5

Rackmount Servers(86)



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Hyper SuperServer SYS-621H-TN12R (Complete System Only )

Key Applications
  • Virtualization
  • Software-defined Storage
  • AI Inference and Machine Learning
  • Cloud Computing
  • Enterprise Server
Key Features  
  1. Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors
  2. 32 DIMM slots supporting up to 8TB of memory; RDIMMs up to DDR5-5600
  3. Optional PCIe slot configurations up to 8 PCIe 5.0 x8 or 4 PCIe 5.0 x16 slots with support for double-width GPU/Accelerator cards
  4. Flexible networking options with up to 2 AIOM networking slots (OCP NIC 3.0 compatible)
  5. 4 heavy duty hot-swap fans with optimal fan speed control
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IoT SuperServer SYS-220HE-FTNR (Complete System Only)

Key Applications
  • 5G Core and Edge
  • Telecom Micro Data Center
  • AI Inference and Machine Learning
  • Network Function Virtualization
  • Cloud Computing
Key Features
  1. Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
  2. 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series
    • 3 PCIe 4.0 x16 slots with GPU/Accelerator support (Default);
    •  1 PCIe 4.0 x16 expansion slots (Optional)
  4. Flexible networking options with 2 AIOM networking slots (OCP NIC 3.0 compatible)
  5. Up to 6x 2.5" hot-swap drive bays with options to support NVMe/SATA drives
  6. 6 heavy duty hot-swap fans with optimal fan speed control Front I/O, tool-less design
  7. Redundant 2000W redundant AC power supplies
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IoT SuperServer SYS-220HE-FTNRD (Complete System Only )

Key Applications
  • 5G Core and Edge
  • Telecom Micro Data Center
  • AI Inference and Machine Learning
  • Network Function Virtualization
  • Cloud Computing
Key Features  
  1. Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
  2. 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM; Intel® Optane™ Persistent Memory 200 series
    • 3 PCIe 4.0 x16 slots with GPU/Accelerator support (Default);
    •  1 PCIe 4.0 x16 expansion slots (Optional)
  4. Flexible networking options with 2 AIOM networking slots (OCP NIC 3.0 compatible)
  5. Up to 6x 2.5" hot-swap drive bays with options to support NVMe/SATA drives
  6. 6 heavy duty hot-swap fans with optimal fan speed control Front I/O, tool-less design
  7. 1300W DC power supplies
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Mainstream A+ Server AS -2024S-TR

Key Applications
  • Virtualization
  • Enterprise Server
  • Data Center Optimized
  • Application and data serving
  • Model analysis
  • Compute Intensive Applications
Key Features
  1. Dual AMD EPYC™ 7003/7002 Series Processors ;Supports Up to 240W CPU TDP;
  2. AMD® SP3
  3. Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz; Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz in 16 DIMMS
    • 3 PCIe 4.0 x16 Low Profile (LP);
    • 3 PCIe 4.0 x8 Low Profile (LP)
  5. Dual Gigabit LAN
  6. 12 hot-swap 3.5" (Tool-less) or 2.5" (screw) drive bays ;(Default configuration is 8 SATA + 4 NVMe) ; (Up to 12x NVMe drives supported with optional NVMe kit);1 M.2 support: ;- M.2 Interface: PCIe 3.0 x4;- M.2 Form Factor: 2260, 2280, 22110;- M.2 Key: M-Key;
  7. 3 heavy duty Hot-swappable 9.4K RPM Cooling Fans;1 air shroud
  8. 920W Redundant Power Supplies Platinum level
  9. 1 rear VGA, 1 Type A port, 1 COM Port, and 4 USB ports
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Mainstream SuperServer SYS-220P-C9R

Key Applications
  • High Performance Computing
  • Enterprise Server
  • Data Center Optimized
  • Database Processing and High Density Storage
  • Application-Optimized Solutions
Key Features
  1. Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors;CPU TDP supports Up to 270W TDP;3 UPI up to 11.2 GT/s
  2. Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz, Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz ;- Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slots (P1-DIMMB2 and P2-DIMMB2 are reserved for Intel® Optane Persistent Memory 200 Series only)
    • 4 PCIe 4.0 x16 Low Profile (LP);
    • 1 PCIe 4.0 x8 Low Profile (LP);
    • * PCIe slot#1 is populated with 1x AOC-S3908L-H8IR-16DD-P to support  8x SAS drives
  4. Dual Gigabit LAN with Intel® i350  Ethernet Controller
  5. 3 heavy duty Hot-swappable 13.5K RPM Middle Cooling Fans with optimal fan speed control;1 air shroud
  6. 1200W Redundant Power Supplies Titanium level 100-240Vac and 200-240 Vdc
  7. 1 rear VGA, 1 Type A port, 2 COM Ports (1 front; 1 rear) and 6 USB ports (2 front USB 2.0 and 4 rear USB 3.0)
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Mainstream SuperServer SYS-220P-C9RT

Key Applications
  • High Performance Computing
  • Enterprise Server
  • Data Center Optimized
  • Database Processing and High Density Storage
  • Application-Optimized Solutions
Key Features
  1. Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors;CPU TDP supports Up to 270W TDP;3 UPI up to 11.2 GT/s
  2. Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz, Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz ;- Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slots (P1-DIMMB2 and P2-DIMMB2 are reserved for Intel® Optane Persistent Memory 200 Series only)
    • 4 PCIe 4.0 x16 Low Profile (LP);
    • 1 PCIe 4.0 x8 Low Profile (LP);
    • * PCIe slot#1 is populated with 1x AOC-S3908L-H8IR-16DD-P to support 8x SAS drives
  4. Dual  10GBase-T LAN with Intel® X550 Ethernet Controller
  5. 3 heavy duty Hot-swappable 13.5K RPM Middle Cooling Fans with optimal fan speed control;1 air shroud
  6. 1200W Redundant Power Supplies Titanium level 100-240Vac and 200-240 Vdc
  7. 1 rear VGA, 1 Type A port, 2 COM Ports (1 front; 1 rear) and 6 USB ports (2 front USB 2.0 and 4 rear USB 3.0)
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Mainstream SuperServer SYS-221P-C9R

Key Applications
  • Virtualization
  • Enterprise Server
  • Application and data serving
  • Compute Intensive Applications
Key Features  
  1. Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors,supports up to 300W TDP
  2. 16 DIMM slots, Up to 4TB DDR5-5600MHZ/4800MHz ECC Registered RDIMM
  3. 4 PCIe 5.0 x16 Low Profile (LP), 1 PCIe 5.0 x8 Low Profile (LP)
  4. 16 hotswap 2.5" drive bays with 8 SAS RAID (0, 1, 5, 6, 10, 50, 60) and 8 SATA drive support
  5. 1200W Redundant Titanium level Power Supplies
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Mainstream SuperServer SYS-221P-C9RT

Key Applications
  • Virtualization
  • Enterprise Server
  • Application and data serving
  • Compute Intensive Applications
Key Features
  1. Dual Socket E (LGA-4677) 5th/4th Gen Intel® Xeon® Scalable processors,supports up to 300W TDP
  2. 16 DIMM slots, Up to 4TB DDR5-5600MHZ/4800MHz ECC Registered RDIMM
  3. 4 PCIe 5.0 x16 Low Profile (LP), 1 PCIe 5.0 x8 Low Profile (LP)
  4. 16 hotswap 2.5" drive bays with 8 SAS RAID (0, 1, 5, 6, 10, 50, 60) and 8 SATA drive support
  5. 1200W Redundant Titanium level Power Supplies
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Mainstream SuperServer SYS-620P-TR

Key Applications
  • Virtualization
  • Enterprise Server
  • Data Center Optimized
  • Application and data serving
  • Model analysis
  • Compute Intensive Applications
Key Features
  1. Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors;CPU TDP supports Up to 270W TDP;3 UPI up to 11.2 GT/s
  2. Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz, Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz ;- Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slots (P1-DIMMB2 and P2-DIMMB2 are reserved for Intel® Optane Persistent Memory 200 Series only)
    • 4 PCIe 4.0 x16 Low Profile (LP);
    • 2 PCIe 4.0 x8 Low Profile (LP)
  4. Dual Gigabit LAN with Intel® i350 Ethernet Controller
  5. 3 heavy duty Hot-swappable 13.5K RPM Middle Cooling Fans with optimal fan speed control;1 air shroud
  6. 1200W Redundant Power Supplies Titanium level 100-240Vac and 200-240 Vdc
  7. 1 rear VGA, 1 Type A port, 2 COM Ports (1 front; 1 rear) and 6 USB ports (2 front USB 2.0 and 4 rear USB 3.0)
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Mainstream SuperServer SYS-620P-TRT

Key Applications
  • Virtualization
  • Enterprise Server
  • Data Center Optimized
  • Application and data serving
  • Model analysis
  • Compute Intensive Applications
Key Features
  1. Dual sockets P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable processors;CPU TDP supports Up to 270W TDP;3 UPI up to 11.2 GT/s
  2. Up to 4TB 3DS ECC RDIMM, DDR4-3200MHz, Up to 4TB 3DS ECC LRDIMM, DDR4-3200MHz ;- Up to 4TB Intel® Optane™ Persistent Memory 200 Series, DDR4-3200MHz, in 18 DIMM slots (P1-DIMMB2 and P2-DIMMB2 are reserved for Intel® Optane Persistent Memory 200 Series only)
    • 4 PCIe 4.0 x16 Low Profile (LP);
    • 2 PCIe 4.0 x8 Low Profile (LP)
  4. Dual  10GBase-T LAN with Intel® X550 Ethernet Controller
  5. 3 heavy duty Hot-swappable 13.5K RPM Middle Cooling Fans with optimal fan speed control;1 air shroud
  6. 1200W Redundant Power Supplies Titanium level 100-240Vac and 200-240 Vdc
  7. 1 rear VGA, 1 Type A port, 2 COM Ports (1 front; 1 rear) and 6 USB ports (2 front USB 2.0 and 4 rear USB 3.0)
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