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Home>Supermicro>Servers & Storage>Twin Servers>Page 6

Twin Servers(83)



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GrandTwin SuperServer SYS-210GT-HNC8F (Complete System Only)

Key Applications
  • HPC
  • Cloud Gaming
  • MEC (Multi-Access Edge Computing)
  • Multi-Purpose CDN
  • High-availability Cache Cluster
  • Telco Edge Cloud
  • EDA (Electric Design Automation)
  • Mission Critical Web Applications
Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
  1. Single-Socket, 3rd Gen Intel® Xeon® Scalable processors up to 270W TDP
  2. Intel® C621A
  3. 16 DIMM Slots up to 4TB
  4. Optional: AIOM PCIe 4.0 x16 LP (OCP 3.0 compliant)
  5. Two optional storage modules. Each module supports 2x NVMe or SAS/SATA drive bays
  6. 2x cooling fans per 2U enclosure, 16.5K RPM Heavy Duty; Shared Cooling Design
  7. 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
  8. Built-in SAS3 Support via Broadcom 3808; IT Mode
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GrandTwin SuperServer SYS-210GT-HNTF (Complete System Only)

Key Applications
  • HPC
  • Cloud Gaming
  • MEC (Multi-Access Edge Computing)
  • Multi-Purpose CDN
  • High-availability Cache Cluster
  • Telco Edge Cloud
  • EDA (Electric Design Automation)
  • Mission Critical Web Applications
Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
  1. Single-Socket, 3rd Gen Intel® Xeon® Scalable processors up to 270W TDP
  2. Intel® C621A
  3. 16 DIMM Slots up to 4TB
  4. Optional: AIOM PCIe 4.0 x16 LP (OCP 3.0 compliant)
  5. Two optional storage modules. Each module supports 2x NVMe or SATA drive bays
  6. 2x cooling fans per 2U enclosure, 16.5K RPM Heavy Duty; Shared Cooling Design
  7. 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
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GrandTwin SuperServer SYS-211GT-HNC8F (Complete System Only)

Key Applications
  • HPC
  • Cloud Gaming
  • MEC (Multi-Access Edge Computing)
  • Multi-Purpose CDN
  • High-availability Cache Cluster
  • Telco Edge Cloud
  • EDA (Electric Design Automation)
  • Mission Critical Web Applications
Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
  1. Single-Socket, 5th/4th Gen Intel® Xeon® Scalable processors up to 350W TDP
  2. Intel® C741
  3. 16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-5600
  4. Optional AIOM module or PCIe 5.0 x16
  5. Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE
  6. Two optional storage modules. Each module supports 2x NVMe or SAS/SATA drive bays
  7. 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
  8. Built-in SAS3 Support via Broadcom 3808; IT Mode
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GrandTwin SuperServer SYS-211GT-HNC8R (Complete System Only)

Key Applications
  • HPC
  • Cloud Gaming
  • MEC (Multi-Access Edge Computing)
  • Multi-Purpose CDN
  • High-availability Cache Cluster
  • Telco Edge Cloud
  • EDA (Electric Design Automation)
  • Mission Critical Web Applications
Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
  1. Single-Socket, 5th/4th Gen Intel® Xeon® Scalable processors up to 300W TDP
  2. Intel® C741
  3. 16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-5600
  4. 2 AIOM
  5. 6x NVMe/SAS/SATA drive bays
  6. 2x cooling fans per 2U enclosure, 16K RPM Heavy Duty; Shared Cooling Design
  7. 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
  8. Built-in SAS3 Support via Broadcom 3808; IT Mode
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GrandTwin SuperServer SYS-211GT-HNTF (Complete System Only)

Key Applications
  • HPC
  • Cloud Gaming
  • MEC (Multi-Access Edge Computing)
  • Multi-Purpose CDN
  • High-availability Cache Cluster
  • Telco Edge Cloud
  • EDA (Electric Design Automation)
  • Mission Critical Web Applications
Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
  1. Single-Socket, 5th/4th Gen Intel® Xeon® Scalable processors up to 350W TDP
  2. Intel® C741
  3. 16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-5600
  4. Optional AIOM module or PCIe 5.0 x16
  5. Integrated GrandTwin I/O Module with BMC, 2x USB, VGA and 2x 10GbE or 2x 25GbE
  6. Two optional storage modules. Each module supports 2x NVMe or SATA drive bays
  7. 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
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GrandTwin SuperServer SYS-211GT-HNTR (Complete System Only)

Key Applications
  • HPC
  • Cloud Gaming
  • MEC (Multi-Access Edge Computing)
  • Multi-Purpose CDN
  • High-availability Cache Cluster
  • Telco Edge Cloud
  • EDA (Electric Design Automation)
  • Mission Critical Web Applications
Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
  1. Single-Socket, 5th/4th Gen Intel® Xeon® Scalable processors up to 300W TDP
  2. Intel® C741
  3. 16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-5600
  4. 2 AIOM
  5. Up to 6 Hot-swap 2.5" NVMe/SATA drives
  6. 2x cooling fans per 2U enclosure, 16K RPM Heavy Duty; Shared Cooling Design
  7. 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
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SuperServer 1029TP-DC0R

Key Applications / Features  - Mission-critical applications - High Availability Storage Appliance Platform Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM 3. 2 PCI-E 3.0 x16 slots 4. Flexible Networking support via SIOM; Dedicated IPMI 2.0 LAN 5. 4 Hot-swap 2.5" SAS3 drive bays 6. Broadcom 3008 SAS3 controller; SW RAID 7. 2 SuperDOM onboard or optional 2 M.2 carrier 8. Up to 1000W Redundant Power Supplies Titanium Level (96%)
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SuperServer 1029TP-DTR

Key Applications / Features  - Mission-critical applications - High Availability Storage Appliance Platform Two hot-pluggable systems (nodes) in a 1U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 16 DIMMs; up to 4TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM 3. 2 PCI-E 3.0 x16 slots 4. Flexible Networking support via SIOM; Dedicated IPMI 2.0 LAN 5. 4 Hot-swap 2.5" SATA3 drive bays 6. 2 SuperDOM onboard or optional 2 M.2 carrier 7. Up to 1000W Redundant Power Supplies Titanium Level (96%)
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SuperServer 2028BT-HNC0R+ (Complete System Only)

Key Features - Hyperscale and Hyperconverged Solutions - Compute Intensive Application - HPC, Data Center - Enterprise Server Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 2 PCI-E 3.0 x16 (LP) slots; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. IPMI 2.0 + KVM with dedicated LAN 5. 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays 6. SAS3 support via Broadcom 3008; IT mode 7. Video via Aspeed AST2400 BMC 8. 4 heavy duty 8cm PWM fans with air shroud 9. 2200W Redundant Power Supplies Titanium Level 10. 2 M.2 Cards support
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SuperServer 2028BT-HNC1R+ (Complete System Only)

Key Features - Hyperscale and Hyperconverged Solutions - Compute Intensive Application - HPC, Data Center - Enterprise Server Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 1 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. IPMI 2.0 + KVM with dedicated LAN 5. 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays 6. SAS3 support via Broadcom 3108; HW RAID 0, 1, 5, 6, 10, 50, 60 7. Video via Aspeed AST2400 BMC 8. 4 heavy duty 8cm PWM fans with air shroud 9. 2200W Redundant Power Supplies Titanium Level 10. 2 M.2 Cards support
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