Twin Servers(83)

Key Features - Compute Intensive Application - HPC, Data Center, Enterprise Server - Hyperscale / Hyperconverged Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1.Dual AMD EPYC™ 7001/7002* Series Processors (*AMD EPYC 7002 series drop-in support requires board revision 2.x) 2.2TB Registered ECC DDR4 2666MHz SDRAM in 16 DIMMs (7001 Processors) 4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs (Board revision 2.x required + 7002 Processors) 3.2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4.Integrated IPMI 2.0 + KVM with dedicated LAN • Software Out of Band License key (SFT-OOB-LIC) included for OOB BIOS management 5.6 Hot-swap 2.5" SATA3 drive bays M.2 Interface: 1 SATA/PCI-E 3.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 6.Video via Aspeed AST2500 BMC 7.2200W Redundant Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)

Key Features - Compute Intensive Applications - HPC, Data Center, Enterprise Server - Hyperscale / Hyperconverged Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual AMD EPYC™ 7003/7002 Series Processors (7003 Series Processor drop-in support requires BIOS version 2.0 or newer) 2. Up to 4TB ECC 3DS LRDIMM, up to DDR4-3200MHz; 16 DIMM slots 3. 2 PCI-E 4.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. Integrated IPMI 2.0 + KVM with dedicated LAN • Software Out of Band License key (SFT-OOB-LIC) included for OOB BIOS management 5. 6 Hot-swap 2.5" drive bays (4 NVMe [Gen3] + 2 SATA3, or 6 SATA3) M.2 Interface: 1 SATA/PCI-E 3.0 x4 and 1 PCI-E 3.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 6. Video via Aspeed AST2500 BMC 7. 2200W Redundant Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)

Key Features - Compute Intensive Applications - HPC, Data Center, Enterprise Server - Hyperscale / Hyperconverged Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual AMD EPYC™ 7003/7002 Series Processors (7003 Series Processor drop-in support requires BIOS version 2.0 or newer) 2. Up to 4TB ECC 3DS LRDIMM, up to DDR4-3200MHz; 16 DIMM slots 3. 2 PCI-E 4.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. Integrated IPMI 2.0 + KVM with dedicated LAN • Software Out of Band License key (SFT-OOB-LIC) included for OOB BIOS management 5. 6 Hot-swap 2.5" SATA3 drive bays M.2 Interface: 1 SATA/PCI-E 3.0 x4 M.2 Form Factor: 2280, 22110 M.2 Key: M-key 6. Video via Aspeed AST2500 BMC 7. 2200W Redundant Power Supplies Titanium Level (96%) (Full redundancy based on configuration and application load)

Key Applications

• All-Flash Hyperconverged Infrastructure
• All-Flash Storage Area Network
• All-Flash Object Storage

Key Features Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Socket P+ (LGA 4189) support 3rd Gen Intel® Xeon® Scalable processors
2. Intel® C621A
3. 20 DIMM Slots (16 DIMM Slots + 4 Intel® Optane™ Persistent Memory Slots)
4. • 1 PCIe 4.0 x16 (LP) slot;
   • 1 PCIe 4.0 x8 (LP) slot;
   • Tool-less support
   • Optional HW RAID Boot Controller via AOC-SMG3-2M2-B (NVMe Only)
   • Internal PCIe 3.0 for 2 x4 M.2 NVMe/SATA support onboard
5. Network connectivity via AIOM (OCP 3.0 compliant)
6. 12 Hot-swap 2.5" drive bays; 12 PCIe 4.0 NVMe/SAS/SATA 2.5" drives
7. 2 cooling fans per node, 16.5K RPM
8. 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
9. Built-in SAS3 Support via Broadcom 3816; IT Mode

Key Applications

• High-Performance File System
• Diskless HPC Clusters
• Scale Out All-Flash NVMe Storage
• Big Data Analytics and AI

Key Features Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Socket P+ (LGA 4189) support 3rd Gen Intel® Xeon® Scalable processors
2. Intel® C621A
3. 20 DIMM Slots (16 DIMM Slots + 4 Intel® Optane™ Persistent Memory Slots)
4. • Optional 2U Riser for Slot 1, CPU1 x16 PCIe 4.0 (RSC-P2R-6G4)
   • 1 PCIe 4.0 x16 (LP) slot;
   • 2 PCIe 4.0 x8 (LP) slot;
   • Tool-less support
   • Optional HW RAID Boot Controller via AOC-SMG3-2M2-B (NVMe Only)
   • Internal PCIe 3.0 for 2 x4 M.2 NVMe/SATA support onboard
5. Network connectivity via AIOM (OCP 3.0 compliant)
6. 12 Hot-swap 2.5" drive bays; 12 PCIe 4.0 NVMe/SATA 2.5" drives
7. 2 cooling fans per node, 16.5K RPM
8. 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
9. Balanced IO Performance (6 PCIe 4.0 NVMe drives per Socket)

Key Applications

• Container-as-a-Service; Application Accelerator
• Diskless HPC Clusters
• All-Flash Hyperconverged Infrastructure

Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Socket P+ (LGA 4189) support 3rd Gen Intel® Xeon® Scalable processors
2. Intel® C621A
3. 20 DIMM Slots (16 DIMM Slots + 4 Intel® Optane™ Persistent Memory Slots)
4. • 2 PCIe 4.0 x16 (LP) slot;
   • Tool-less support
   • Optional HW RAID Boot Controller via AOC-SMG3-2M2-B (NVMe Only)
   • Internal PCIe 3.0 for 2 x4 M.2 NVMe/SATA support onboard
5. Network connectivity via AIOM (OCP 3.0 compliant)
6. 6 Hot-swap 2.5" drive bays; 6 PCIe 4.0 NVMe/SAS/SATA 2.5" drives
7. 4 cooling fans per 2U enclosure, 16.5K RPM; Shared Cooling Design
8. 2600W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
9. Built-in SAS3 Support via Broadcom 3808; IT Mode

Key Applications

• Container-as-a-Service; Application Accelerator
• Diskless HPC Clusters
• All-Flash Hyperconverged Infrastructure

Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Socket P+ (LGA 4189) support 3rd Gen Intel® Xeon® Scalable processors
2. Intel® C621A
3. 20 DIMM Slots (16 DIMM Slots + 4 Intel® Optane™ Persistent Memory Slots)
4. • 2 PCIe 4.0 x16 (LP) slot;
   • Tool-less support
   • Optional HW RAID Boot Controller via AOC-SMG3-2M2-B (NVMe Only)
   • Internal PCIe 3.0 for 2 x4 M.2 NVMe/SATA support onboard
5. Network connectivity via AIOM (OCP 3.0 compliant)
6. 6 Hot-swap 2.5" drive bays; 6 PCIe 4.0 NVMe/SAS/SATA 2.5" drives
7. 4 cooling fans per 2U enclosure, 16.5K RPM; Shared Cooling Design
8. 2600W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
9. Built-in SAS3 Support via Broadcom 3808; IT Mode

Key Applications

• Mission Critical HPC
• Virtualized Big Data Analytics
• High-Density Storage RAID Array

Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Socket P+ (LGA 4189) support 3rd Gen Intel® Xeon® Scalable processors
2. Intel® C621A
3. 20 DIMM Slots (16 DIMM Slots + 4 Intel® Optane™ Persistent Memory Slots)
4. • 1 PCIe 4.0 x16 (LP) slot;
   • Tool-less support
   • Optional HW RAID Boot Controller via AOC-SMG3-2M2-B (NVMe Only)
   • Internal PCIe 3.0 for 2 x4 M.2 NVMe/SATA support onboard
5. Network connectivity via AIOM (OCP 3.0 compliant)
6. 6 Hot-swap 2.5" drive bays; 6 PCIe 4.0 NVMe/SAS/SATA 2.5" drives
7. 4 cooling fans per 2U enclosure, 16.5K RPM; Shared Cooling Design
8. 2600W Redundant Power Supplies Titanium Level (96%+); Shared Power Design
9. Built-in SAS3 Support via Broadcom SAS3908

Key Applications

• All-Flash NVMe Hyperconverged Infrastructure
• Container-as-a-Service; Application Accelerator
• High-Performance File System
• Diskless HPC Clusters

Key Features Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Socket P+ (LGA 4189) support 3rd Gen Intel® Xeon® Scalable processors
2. Intel® C621A
3. 20 DIMM Slots (16 DIMM Slots + 4 Intel® Optane™ Persistent Memory Slots)
4. • 2 PCIe 4.0 x16 (LP) slot;
   • Tool-less support
   • Optional HW RAID Boot Controller via AOC-SMG3-2M2-B (NVMe Only)
   • Internal PCIe 3.0 for 2 x4 M.2 NVMe/SATA support onboard
5. Network connectivity via AIOM (OCP 3.0 compliant)
6. 6 Hot-swap 2.5" drive bays; 6 PCIe 4.0 NVMe/SATA 2.5" drives
7. 4 cooling fans per 2U enclosure, 16.5K RPM; Shared Cooling Design
8. 2600W Redundant Power Supplies Titanium Level (96%+); Shared Power Design

Key Applications

• All-Flash Hyperconverged Infrastructure
• All-Flash Storage Area Network
• All-Flash Object Storage

Key Features Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

1. Socket E (LGA 4677) support 5th/4th Gen Intel® Xeon® Scalable processors
2. Intel® C741
3. 16 DIMM Slots supporting up to 4TB of memory; ECC RDIMMs up to DDR5-5600
4. • Internal PCIe 4.0 x8 for 2 M.2 NVMe support onboard
   • 1 PCIe 5.0 x16 (LP) slot;
   • 1 PCIe 5.0 x8 (LP) slot;
   • Tool-less support
   • Optional M.2 (22x80) HW RAID1 NVMe Boot Controller via SCC-A2NM2241G3-B1
5. Network connectivity via AIOM (OCP 3.0 compliant)
6. • Built-in SAS3 Support via Broadcom 3816; IT Mode
   • 12 hot-Swap 2.5” drive bays (2x PCIe 5.0 NVMe/SAS and 10x PCIe 4.0 NVMe/SAS)
7. • Liquid Cooling Support
   • 4 cooling fans per 2U enclosure, 16.5K RPM; Shared Cooling Design
8. 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design