Twin Servers(83)

Key Features  - Compute Intensive Application - HPC, Data Center - Enterprise Server - Financial Analysis - Mission-critical applications Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 2 PCI-E 3.0 x16 (LP) slots; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. IPMI 2.0 + KVM with dedicated LAN 5. 6 Hot-swap 2.5" NVMe drive bays 6. Video via Aspeed AST2400 BMC 7. 4x 8cm heavy duty PWM fans with air shroud 8. 2200W Redundant Power Supplies Titanium Level 9. 2 M.2 Cards support

Key Features  - Compute Intensive Application - HPC, Data Center - Enterprise Server - Financial Analysis - Mission-critical applications Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s 2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24 DIMM slots 3. 2 PCI-E 3.0 x16 (LP) slots; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. IPMI 2.0 + KVM with dedicated LAN 5. 6 Hot-swap 2.5" SATA3 drive bays 6. Video via Aspeed AST2400 BMC 7. 4 heavy duty 8cm PWM fans with air shroud 8. 2200W Redundant Power Supplies Titanium Level

Key Applications / Features  - Compute Intensive Application - HPC, Data Center, Enterprise Server - Hyperscale / Hyperconverged Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 x8 slot, 1 PCI-E 3.0 x16, 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. 4 NVMe/SAS3 + 8 SAS3 Hot-swap 2.5" drive bays; 2 internal M.2 NVMe/SATA slots 5. SAS3 support via Broadcom 3216; IT mode 6. IPMI 2.0 + KVM with dedicated LAN 7. Video via Aspeed AST2500 BMC 8. 4 Heavy duty 8cm PWM fans with air shroud 9. 2200W Redundant Power Supplies Titanium Level (96%)

Key Applications / Features  - Compute Intensive Application - HPC, Data Center, Enterprise Server - Hyperscale / Hyperconverged Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays; 2 M.2 SATA3 or NVMe support 5. SAS3 support via Broadcom 3008; IT mode 6. 1 Carrier Card slot (M.2 support) 7. IPMI 2.0 + KVM with dedicated LAN 8. Video via Aspeed AST2500 BMC 9. 4 Heavy duty 8cm PWM fans with air shroud 10. 2200W Redundant Power Supplies Titanium Level (96%)

Key Features - Compute Intensive Application - HPC, Data Center, Enterprise Server - Hyperscale / Hyperconverged Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 1 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5" drive bays; 2 M.2 SATA3 or NVMe support 5. SAS3 support via Broadcom 3108; RAID 0, 1, 5, 6, 10, 50, 60 6. 1 Carrier Card slot (M.2 support) 7. IPMI 2.0 + KVM with dedicated LAN 8. Video via Aspeed AST2500 BMC 9. 4 Heavy duty 8cm PWM fans with air shroud 10. 2200W Redundant Power Supplies Titanium Level (96%)

Key Features  - Compute Intensive Application - HPC, Data Center, Enterprise Server - Hyperscale / Hyperconverged Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. 6 Hot-swap 2.5" NVMe drive bays; 2 M.2 SATA3 or NVMe support 5. 1 Carrier Card slot (M.2 support) 6. IPMI 2.0 + KVM with dedicated LAN 7. Video via Aspeed AST2500 BMC 8. 4 Heavy duty 8cm PWM fans with air shroud 9. 2200W Redundant Power Supplies Titanium Level (96%)

Key Features  - Hyperscale / Hyperconverged - Compute Intensive Application - Data Center, Enterprise, HPC Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 x16 (LP) slots; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. 4 Hot-swap 2.5" NVMe/SATA3 + 2 Hot-swap 2.5" SATA3 drive bays; 1 M.2 SATA3 or NVMe support 5. IPMI 2.0 + KVM with dedicated LAN 6. Video via Aspeed AST2500 BMC 7. 4 Heavy duty 8cm PWM fans with air shroud 8. 2200W Redundant Power Supplies Titanium Level (96%)

Key Features - Compute Intensive Application - HPC, Data Center, Enterprise Server - Hyperscale / Hyperconverged Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. 6 Hot-swap 2.5" SATA3 drive bays 5. IPMI 2.0 + KVM with dedicated LAN 6. Video via Aspeed AST2500 BMC 7. 4 Heavy duty 8cm PWM fans with air shroud 8. 2200W Redundant Power Supplies Titanium Level (96%)

Key Features  - Compute Intensive Application - HPC, Data Center, Enterprise Server - Hyperscale / Hyperconverged Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following: 1. Dual Socket P (LGA 3647) support 2nd Gen Intel® Xeon® Scalable processors (Cascade Lake/Skylake)‡ 2. 24 DIMMs; up to 6TB 3DS ECC DDR4-2933MHz† RDIMM/LRDIMM, Supports Intel® Optane™ DCPMM†† 3. 2 PCI-E 3.0 x16 (LP) slot; 1 SIOM card support (flexible networking) Note: must bundle with Network card 4. 6 Hot-swap 2.5" NVMe drive bays; 2 M.2 SATA3 or NVMe support 5. 1 Carrier Card slot (M.2 support) 6. IPMI 2.0 + KVM with dedicated LAN 7. Video via Aspeed AST2500 BMC 8. 16 Heavy duty 40x56mm fans with optimal fan speed control (4 fans per node) 9. 2600W Redundant Power Supplies Titanium Level (96%)